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A fast positioning method and system

A positioning method and fast technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as crushing, breakdown, cracks, etc., to improve packaging efficiency and reduce positioning time.

Active Publication Date: 2021-11-30
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Once inertial vibration occurs, it may cause solder balls to hit the chip, chip damage, cracks, crushing, breakdown, etc.

Method used

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  • A fast positioning method and system
  • A fast positioning method and system
  • A fast positioning method and system

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Experimental program
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Embodiment Construction

[0042] Embodiments of the present invention will be described in detail below, and examples of the embodiments are illustrated in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The following is exemplary, and is intended to be illustrative of the invention, not to be construed as limiting the invention.

[0043] By below Figure 1 to 3 A rapid positioning method of the embodiment of the present invention, including the steps of:

[0044] S1: Get the time t that starts inertia vibration during the package equipment traditional soft landing process 0 , Inertial vibration balance position and search height H between the target position s And the traditional soft continent method completes the low-speed uniform speed value of the operation head to the target position after the inertial vibration balance position is stabilized. c ;

[0045] S2: Gets the active vibration displacement v...

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Abstract

The invention discloses a fast positioning method and system, and relates to the technical field of semiconductor packaging. A rapid positioning method for the soft landing positioning process of electronic packaging equipment such as wire bonding machines, flip-chip machines, and die-bonding machines. Firstly, according to the traditional soft landing of the packaging equipment operating head, it starts from inertial vibration to vibration according to the packaging equipment operating head. The time for the decay to complete, calculate the uniform speed T required for the operating head to reach the target position from the inertial vibration equilibrium position within this time s ; When the inertial vibration of the operating head occurs during the soft landing process, the driving parts of the operating head follow the set uniform speed T s During the whole inertial vibration process of soft landing, the driving effect is continuously applied to the operating head until the operating head reaches the target position, so that the operating head can continuously approach the target position while the inertial vibration is attenuated. Compared with the traditional soft landing technology, the operating head is effectively reduced. positioning time and improve packaging efficiency.

Description

Technical field [0001] The present invention relates to semiconductor packaging technology, and more particularly, to a method and system for quick positioning. Background technique [0002] The electronic package such as a wire bonding machine equipment, installed inverted, solid crystal and the like are equipped with chip manufacturing a key, which is the key technology precision positioning chip packaging equipment. First, the chip is fabricated on the chip substrate, there are many die on the same chip substrate, the chips must be packaged between the connection point of the metal chips by encapsulating equipment, fabricated chips can be used may be turned on. As the package wire bonding process, a wire bonding machine Z-axis motion system requires rapid precise positioning operation is completed, this movement needs to meet the technical requirements of the current art are: large stroke 5-30mm; speed 0.2-1m / s; high acceleration> 10g; less precision 1-2um. In the flip-ch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/67
CPCH01L21/67126H01L21/68
Inventor 张揽宇高健陈新陈云贺云波
Owner GUANGDONG UNIV OF TECH