Epitaxial slice cleaning device

Abstract

The invention discloses an epitaxial slice cleaning device. The epitaxial slice cleaning device comprises a cleaning tank, a slide frame, a cleaning mechanism, a rotating mechanism and a drying mechanism, wherein the cleaning tank is equipped with a partition plate for dividing the cleaning tank into a primary cleaning region and a fine cleaning region; lead screws are arranged at the tops at the two sides of the cleaning tank; the slide frame capable of sliding on the cleaning tank is arranged on the lead screws; slide blocks placed on the lead screws are arranged at the two ends of the slide frame; threads are processed on the bottom surfaces of the slide blocks; the cleaning mechanism is arranged above the slide frame; the rotating mechanism is arranged below the slide frame; and one end, away from the primary cleaning region, of the fine cleaning region is equipped with the drying mechanism. The lead screws are arranged on the cleaning tank, the slide frames are arranged on the lead screws, and the rotating lead screws drive the slide frames to move; the cleaning device mounted on the cleaning tank cleans an epitaxial slice on the slide frames, and is matched with the rotating mechanism to drive the epitaxial slice to rotate on the slide frames, so that a cleaning dead corner is reduced, and cleaning quality is guaranteed; and the epitaxial slice cleaning device can be matched with the drying device for timely clearing water spots left on the epitaxial slice, so that secondary pollution is avoided.

Description

technical field [0001] The invention relates to the field of epitaxial wafer production equipment, in particular to an epitaxial wafer cleaning device. Background technique [0002] The epitaxial wafer is cut from the processed single crystal silicon rod. The surface of the cut epitaxial wafer is prone to residual pollutants. These pollutants will affect the quality of the epitaxial wafer and thus affect the performance of the chip. Therefore, the epitaxial wafer needs to be cleaned. There are two main cleaning methods, one is manual cleaning, and the other is washing machine cleaning. The efficiency of manual cleaning is low, and some cleaning fluids will cause harm to human health, while the efficiency of machine cleaning is improved. , but there will be situations where the cleaning is not thorough. Therefore, a device that can thoroughly clean the epitaxial wafers is needed to ensure the cleaning quality. Contents of the invention [0003] The object of the present in...

AI Technical Summary

Problems solved by technology

[0002] The epitaxial wafer is cut from the processed single crystal silicon rod. The surface of the cut epitaxial wafer is prone to residual pollutants. These pollutants will affect the quality of the epitaxial wafer and thus affect the performance of the chip. Therefore, the epitaxial wafer needs to be cleaned. There are two main cleaning methods, one is manual cleaning, and the other is washing machine cleaning. The efficiency of manual cleaning is low, and some cleaning fluids will cause harm to human health, while the efficiency of machine cleaning is improved. , but there will be incomplete cleaning, so a device that can thoroughly clean epitaxial wafers is needed to ensure the cleaning quality

Images