Ceramic substrate, electrostatic chuck and manufacturing method of electrostatic chuck
An electrostatic chuck, ceramic substrate technology, applied in the application of electrostatic attraction holding devices, manufacturing tools, semiconductor/solid-state device manufacturing, etc., can solve the problem of inability to obtain bonding strength
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no. 1 example
[0051] Reference now Figure 1 to 20 The first embodiment is described.
[0052] figure 1 It is a schematic cross-sectional view of the electrostatic suction cup of the first embodiment.
[0053] like figure 1 As shown, the electrostatic suction cup 1 includes a bottom plate 10 and a mounting table 20 disposed on the bottom plate 10. The mounting table 20 is fixed to the upper surface of the bottom plate 10 by a binder such as a silicone resin. Note that the mounting table 20 can also be secured to the bottom plate 10 by screws. The substrate W is placed on the upper surface of the mounting table 20. The substrate W is, for example, a semiconductor wafer or the like. The electrostatic suction cup 1 is configured to adsorb and hold the substrate W placed on the mounting table 20.
[0054] like figure 2 As shown, when viewed from above, the bottom plate 10 and the mounting table 20 have a circular shape. That is, the bottom plate 10 and the mounting table 20 have a disk shape. like ...
no. 2 example
[0114] Below, referring to Figure 21 and Figure 22 A second embodiment is described. Figure 21 It is a schematic cross-sectional view of the semiconductor package of the second embodiment, and Figure 22 It is a schematic plan view of a semiconductor package.
[0115] like Figure 21 As shown, the package 100 for the semiconductor device includes a ceramic substrate 110, a heat sink 150, and an outer connection terminal 160, and the heat sink 150 is welded to the ceramic substrate 110.
[0116] The ceramic substrate 110 includes a plurality of ceramic substrates 111, 112, 113, and 114, which are laminated (four in the present embodiment); the wiring patterns 121, 122, 123, 124, composed of tungsten; and through the ceramic substrate 112 The conductive holes 132, 133, 134 of 113, 114 are 113, 114. The conductive holes 132 interconnect the wiring patterns 121 and 122, and the conductive holes 133 interconnect the wiring patterns 122 and 123, and the conductive holes 134 interconnect t...
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Abstract
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