Light-emitting diode testing circuit, light-emitting diode testing method and manufacturing method
A technology for light-emitting diodes and a manufacturing method, which is applied in diode testing, semiconductor/solid-state device testing/measurement, circuits, etc., and can solve problems such as difficulty in measuring light-emitting diodes
Pending Publication Date: 2021-08-13
EPISTAR CORP
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- Application Information
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Problems solved by technology
However, in small-sized light-emitting diodes, the size of the electrodes and the distance between electrodes are also reduced, and it is difficult to measure light-emitting diodes using existing probes and measurement methods
Method used
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[0040] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to drawings so that those skilled in the art of the present invention can fully understand the spirit of the present invention. The present invention is not limited to the following embodiments, but may be implemented in other forms. In this specification, there are some same symbols, which represent elements with the same or similar structure, function, and principle, and those with general knowledge in the industry can infer based on the teaching of this specification. For the sake of brevity in the description, elements with the same symbols will not be repeated.
[0041] figure 1 A light-emitting diode manufacturing method showing an embodiment of the present invention, figure 2 After step S1 and step S2 are completed, a plurality of light emitting diodes 1 are formed on the substrate 10 to form a cross-sectional view of a light emitting diode wafer (wafer) 100 ...
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Abstract
Disclosed are a light-emitting diode test circuit, a light-emitting diode test method and a manufacturing method. The manufacturing method for an LED includes: providing a substrate having an upper surface divided into a plurality of zones; a LED group formed on each of the zones and wherein: a plurality of the LED groups includes a first LED group; and the LEDs of the first LED group include a defective LED; forming a testing circuit on the substrate to electrically connect the LEDs; testing the first LED group by the testing circuit; recording a position of the defective LED; providing a carrier; and performing one of the following steps by the position of the defective LED: removing the defective LED from the substrate and then transferring the other LEDs in the first LED group to the carrier; transferring the other LEDs other than the defective LED in the first LED group to the carrier; or transferring the LEDs to the carrier and repairing it on the carrier.
Description
technical field [0001] The invention relates to a light-emitting diode test circuit, a light-emitting diode test method and a manufacturing method. Background technique [0002] In the existing light-emitting diode measurement method, for example, when electroluminescence (EL) is used to measure the characteristics of the light-emitting diode, the probe acts on the electrode of the light-emitting diode to provide a test current to obtain the photoelectric characteristics of the light-emitting diode. Specifically, the tips of the two probes respectively contact the p and n electrodes of the LED. However, in small-sized light-emitting diodes, the size of the electrodes and the distance between the electrodes are also reduced, and it is difficult to measure the light-emitting diodes using existing probes and measurement methods. Contents of the invention [0003] The invention discloses a method for manufacturing a light-emitting diode, which includes: providing a substrate,...
Claims
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IPC IPC(8): H01L33/00H01L21/66G01R31/26
CPCG01R31/2635H01L22/14H01L22/34H01L33/0095H01L21/6835H01L27/156H01L2221/68368H01L22/22H01L25/0753H01L33/62H01L2221/68354H01L2933/0066
Inventor 蔡佳珍涂嘉良李奇霖
Owner EPISTAR CORP