A method for gold-plated gold fingers on three sides
A gold finger and finger technology, which is applied in the field of gold plating on three sides of the gold finger, can solve the problems of short service life of the gold finger board, copper leakage, oxidation and corrosion, and easy loss of shrapnel, and achieve the effect of improving the quality of gold plating and service life.
Active Publication Date: 2022-03-04
广州广合科技股份有限公司
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Problems solved by technology
[0004] When the gold finger is in contact with the shrapnel in the card slot 40 of the main board, the service life of the gold finger board is short due to the uneven cut surface and copper leakage and oxidation corrosion at the plug end of the gold finger, and the card slot 40 on the main board Shrapnel is easy to wear
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[0034] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the drawings but not all of them.
[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it ...
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The invention relates to the technical field of circuit board processing, and discloses a three-sided gold-plated method for gold fingers. A top board, an inner board and a bottom board are pressed together to form a PCB substrate. The top board has gold fingers, and one inner board has a grounding circuit. Metal holes and via holes are opened on the substrate, and both the metal holes and the via holes run through the upper and lower sides of the substrate in the thickness direction. The edge of the substrate has an electroplating clamping edge which is connected to the via hole. S1: The gold finger is connected to the ground line through the corresponding metal hole. S2: An inner layer lead wire is provided on the inner layer board with a grounding line, and the grounding line is connected to the via hole through the inner layer lead wire. S3: The electroplating clip edge is connected to the external power supply, and the gold finger is plated with gold. S4: Back-drill the metal hole on the bottom board to disconnect the ground line from the metal hole. The gold-plated method on three sides of the gold finger avoids the unevenness of the plug end surface of the gold finger and the corrosion of copper leakage after the gold-plated lead wire is removed, and improves the service life of the gold finger.
Description
technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a gold-plated method for three sides of a gold finger. Background technique [0002] Gold fingers are composed of many golden-yellow conductive contacts, which are called "gold fingers" because their surfaces are gold-plated and the conductive contacts are arranged like fingers. Gold fingers are used for model transfer. For example, all signals between memory sticks and memory slots, graphics cards and graphics card slots in computer hardware are transmitted through golden fingers. [0003] Such as figure 1 As shown, a pad similar to finger arrangement is designed on the basic insulating board of the PCB, and at the same time, a layer of copper layer 101, a layer of nickel layer 102 and a layer of gold layer 103 are sequentially plated on both sides of the pad to strengthen the copper layer 101. Abrasion resistance and conductivity of the surface. ...
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IPC IPC(8): H05K3/40
CPCH05K3/403
Inventor 张志超彭镜辉麦美环向参军陈梓阳陈俊玲潘梓瑜
Owner 广州广合科技股份有限公司