Full-automatic chip single-point tin removal equipment
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN ZHUO MAO TECH
- Publication Date
- 2021-08-20
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Abstract
Description
technical field
[0001] The invention relates to the technical field of chip tin removal, in particular to a fully automatic chip single-point tin removal device. Background technique
[0002] With the rapid development of the electronic industry, the integration capability of electronic products is constantly improving, and the functions are becoming more and more powerful while the volume is becoming smaller and smaller. As the layout of electronic components becomes more and more compact, the process requirements for BGA and chips are also increasing, and the diameter of the solder balls on the chips is getting smaller and smaller, so there will be a certain probability of bridges, Bad problems such as large and small balls, virtual soldering, and misalignment.
[0003] Therefore, it is necessary to rework these defective chips for the defect points, remove the solder balls with defects, and then perform ball planting correction. Similarly, the BGA removed from the PCB i...