Full-automatic chip single-point tin removal equipment

Abstract

The invention discloses full-automatic chip single-point tin removal equipment. The full-automatic chip single-point tin removal equipment comprises a material conveying device, a material transferring device, a plurality of preheating conveying devices and a single-point tin removal device, wherein the material transferring device is perpendicular to the material conveying device and is arranged above one end of the material conveying device; the preheating conveying devices are parallel to the material conveying device and are arranged on one side of the material conveying device; the single-point tin removal device is arranged above the other end of the material conveying device; the material conveying device is used for conveying chips to be detinned to the position below the material transferring device, and the material transferring device is used for transferring the chips to the preheating conveying device; the preheating conveying device is used for preheating a chip and conveying a preheated chip to the position below the single-point tin removal device; the single-point tin removal device is used for detinning the chip. According to the full-automatic chip single-point tin removal equipment, design is reasonable, structure is compact, automation degree is high and operation is convenient, all procedures of automatic feeding and discharging and automatic tin removal can be achieved, manual intervention is reduced, then labor cost can be reduced, and working efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of chip tin removal, in particular to a fully automatic chip single-point tin removal device. Background technique [0002] With the rapid development of the electronic industry, the integration capability of electronic products is constantly improving, and the functions are becoming more and more powerful while the volume is becoming smaller and smaller. As the layout of electronic components becomes more and more compact, the process requirements for BGA and chips are also increasing, and the diameter of the solder balls on the chips is getting smaller and smaller, so there will be a certain probability of bridges, Bad problems such as large and small balls, virtual soldering, and misalignment. [0003] Therefore, it is necessary to rework these defective chips for the defect points, remove the solder balls with defects, and then perform ball planting correction. Similarly, the BGA removed from the PCB i...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a fully automatic chip single-point tin removal equipment to solve the problems of low tin removal efficiency, high tin removal cost, and easily damaged chips in the existing tin removal methods.

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