Method for packaging metal needle through glass and glass packaging product
A technology of glass encapsulation and metal pins, which is applied in the field of glass encapsulation, and can solve problems affecting high airtightness, high stability, service life, inapplicability, and low airtightness of products
Inactive Publication Date: 2021-08-20
泰极微(成都)技术发展有限公司
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Problems solved by technology
Most of the existing glass encapsulation technologies first perforate the glass, and then embed conductive glue, sputtered metal film or electroplated metal entities in the holes. Glass encapsulation products using this method will have tiny gaps and cavities, resulting in product failure. Airtightness and other functions are not high, and are mainly used in consumer electronics or semiconductor chips, but cannot be used in aerospace, deep sea, biochemical and other fields that require high airtightness
Moreover, the conduction material in the glass is also relatively important, which can directly affect the high air tightness, high stability and service life in extreme environments that the original TGV products cannot achieve. embedded in glass wafer
Method used
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[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0033] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two ...
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Abstract
The invention relates to the technical field of glass packaging, and discloses a method for packaging a metal needle through glass and a glass packaging product. The method for packaging the metal needle through the glass comprises the following steps of S1, arranging a plurality of metal needles at intervals in the vertical direction according to a preset pattern; S2, vertically laying a glass sheet on the upper surfaces of the plurality of metal needles; and S3, heating the glass sheet to melt the glass sheet, and carrying out fusion bonding on the molten glass solution and the metal needles. According to the method for packaging the metal needle by using the glass, the molten glass and the metal needle are fused and bonded, so that no fine gap or cavity exists between the metal needle and the glass, the air tightness and the stability between the glass and the metal needle are relatively high, the prepared product can be applied to special environments such as high temperature, high humidity, high pressure or vacuum, and relatively long service life is maintained. The glass packaging product is relatively high in air tightness and can be applied to an environment with a high air tightness requirement.
Description
technical field [0001] The invention relates to the technical field of glass encapsulation, in particular to a method for glass encapsulating metal pins and glass encapsulation products. Background technique [0002] Because of its many unique characteristics, glass has become an indispensable substrate carrier in the wafer thinning process, and can often be used as a substrate material for through-hole glass (TGV). Most of the existing glass encapsulation technologies first perforate the glass, and then embed conductive glue, sputtered metal film or electroplated metal entities in the holes. Glass encapsulation products using this method will have tiny gaps and cavities, resulting in product failure. The functions such as air tightness are not high, and they are mainly used in consumer electronics or semiconductor chips, but cannot be used in aerospace, deep sea, biochemical and other fields that require high airtightness. Moreover, the conduction material in the glass is ...
Claims
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IPC IPC(8): C03C27/02
CPCC03C27/02
Inventor 杨军
Owner 泰极微(成都)技术发展有限公司