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Adhesive tape lapping process

A tape and process technology, applied in the field of tape overlap technology, can solve the problems of rising mold cost, rising product cost, high cost, etc., and achieve the effect of improving cost advantage, improving efficiency and output, and reducing cost

Pending Publication Date: 2021-08-27
SUZHOU HI TECH ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] ①The round knife automatic paste process, for a small number of varieties, the round knife process will increase the cost of the mold, resulting in an increase in product cost;
[0007] ② Manual assembly process, for relatively small orders, the traditional manual assembly process costs more and has no competitive advantage

Method used

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  • Adhesive tape lapping process
  • Adhesive tape lapping process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] 1 Cut out the interface on the 0.03mm conductive adhesive copper foil (that is, the first tape) through the die-cutting knife die A;

[0048] 2. Compound a layer of 0.07mm double-sided silicone oil paper on the surface of 0.03mm conductive adhesive copper foil and the interface of 0.03mm conductive adhesive copper foil can exceed 2mm;

[0049] 3. Use an automatic laminating machine to paste 0.03mm PET double-sided tape (ie, the second tape) on the other side of the silicone oil paper;

[0050] 4. Cut off the 0.03mm PET double-sided adhesive tape through the die-cutting knife die B, cut the incision on the 0.03 mm PET double-sided adhesive tape and cut off the PET double-sided adhesive tape, and the lower layer of silicone oil paper is continuous;

[0051] 5 After eliminating the waste of 0.03mm PET double-sided tape, pull out the silicone oil paper, and naturally contact the overlapping joint of 0.03mm conductive adhesive copper foil and 0.03mm PET double-sided adhesive...

Embodiment 2

[0053] 1 Cut out the interface on the 0.03mm conductive adhesive copper foil (that is, the first tape) through the die-cutting knife die A;

[0054] 2 Compound a layer of 0.06mm double-sided silicone oil paper on the surface of 0.03mm conductive adhesive copper foil and the interface between 0.03mm conductive adhesive copper foil can exceed 3mm;

[0055] 3. Use an automatic laminating machine to paste 0.04mm conductive adhesive copper foil (that is, the second adhesive tape) on the other side of the silicone oil paper;

[0056] 4 Cut off the 0.04mm conductive adhesive copper foil through the die-cutting knife die B, cut out the incision on the 0.04mm conductive adhesive copper foil and cut off the PET double-sided adhesive tape, and the lower layer of silicone oil paper is continuous;

[0057] 5 After excluding the waste of 0.04mm conductive adhesive copper foil, pull out the silicone oil paper, and naturally contact the overlapping joints of 0.03mm conductive adhesive copper ...

Embodiment 3

[0059] 1 Cut out the interface on the 0.03mm PET double-sided adhesive tape (that is, the first tape) through the die-cutting knife die A;

[0060] 2. Compound a layer of 0.05mm double-sided silicone oil paper and 0.03mm conductive adhesive copper foil on the surface of 0.03mm PET double-sided adhesive tape to exceed 4mm;

[0061] 3. Use an automatic laminating machine to paste 0.03mm PET double-sided tape (ie, the second tape) on the other side of the silicone oil paper;

[0062] 4 Cut off the 0.03mm PET double-sided adhesive of the second adhesive tape through the die-cutting knife die B, cut out the 0.03mm PET double-sided adhesive and cut off the PET double-sided adhesive of the second adhesive tape, and the lower layer of silicone oil paper is continuous;

[0063] 5 After excluding the waste of the PET double-sided adhesive of the 0.03mm second tape, pull out the silicone oil paper, and the overlapping of the PET double-sided adhesive of the 0.03mm first tape and the PET ...

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PUM

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Abstract

The invention discloses an adhesive tape lapping process. The adhesive tape lapping process comprises the following steps: preparation of a first adhesive tape: preparing the first adhesive tape on backing paper, and at least partially attaching double-sided release paper to one side, far away from the backing paper, of the first adhesive tape to meet the requirement that the double-sided release paper at least covers a lapping work region on the first adhesive tape, wherein the lapping work region is set at least according to lapping parameters of the first adhesive tape and a second adhesive tape; attaching of the second adhesive tape: attaching the second adhesive tape to the side, away from the first adhesive tape, of the double-sided release paper, wherein the overlapping range of the first adhesive tape, the double-sided release paper and the second adhesive tape is located in the lapping work region; die cutting: cutting the second adhesive tape off in the lapping work region according to the lapping parameters, and moving cut-off waste materials out; and lapping: pulling the double-sided release paper away, and attaching the parts, in the lapping work region, of the first adhesive tape and the second adhesive tape. The above scheme is simple and efficient, and effectively overcomes the defects of low efficiency and high cost when small quantities of diversified adhesive tapes are attached in the prior art.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an adhesive tape lapping process. Background technique [0002] In the production of electronic equipment, it usually involves matching and connecting a variety of different adhesive tapes to meet the needs of product fixing and conduction. Two traditional tape lapping die-cutting processes (lap width below 2mm), processing classification: [0003] ① Round knife automatic pasting process, for relatively large orders, the industry adopts round knife automatic pasting process for production; [0004] ②Manual assembly process, for relatively small orders, if the round knife is made, the round knife mold itself is relatively expensive, so the manual assembly process is generally used for production. [0005] These solutions have some disadvantages for a small number of diverse products of this type: [0006] ①The round knife automatic paste process, for a small number of varie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/00
CPCC09J5/00
Inventor 汪义方安海宁黄方亮
Owner SUZHOU HI TECH ELECTRONICS CO LTD
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