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cob automatic assembly equipment

A technology of automatic assembly and equipment, applied in the direction of assembling printed circuits, electrical components, circuits, etc. with electrical components, can solve the problems of reducing equipment space utilization, increasing equipment costs, large working space, etc., to improve material distribution efficiency, improve Efficiency and precision, the effect of improving space utilization

Active Publication Date: 2021-11-23
TZTEK TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The working platform and transmission mechanism occupy a large working space, which reduces the space utilization rate of the equipment and increases the cost of the entire equipment.

Method used

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  • cob automatic assembly equipment
  • cob automatic assembly equipment

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Embodiment Construction

[0067] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0068] The COB (Chip On Board, chip on board) assembly involved in the embodiment of the present invention is an assembly process for installing chips on a circuit board. A cover to protect it, the assembly of the cover on the circuit board is part of the COB assembly.

[0069] Such as figure 1 as shown, figure 1 Including the first material and the second material, that is, the cover an...

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Abstract

The present invention provides a COB automatic assembly device, which includes a device body. The device body includes a first base, a transmission mechanism, a first pick-up mechanism, a positioning mechanism, a glue dispensing mechanism and a second pick-up mechanism. The transmission mechanism is used to transport the carrier. The first material is installed on the carrier, the first pick-up mechanism is used to pick up the first material and place it on the carrier, the positioning mechanism is installed on the transmission mechanism, and the positioning mechanism is used to stop the carrier and position it , the second pick-up mechanism is used to pick up the second material and place it on the dispensing area on the first material, so that the second material is assembled on the first material through the adhesive to form a third material; The assembly equipment uses the positioning mechanism to stop the carrier on the transmission mechanism, and the carrier acts as a work platform without setting up a separate work platform to place the carrier, which greatly improves the space utilization of the COB automatic assembly equipment and further reduces the overall Equipment assembly costs.

Description

technical field [0001] The invention relates to the field of COB automatic assembly, in particular to COB automatic assembly equipment. Background technique [0002] COB (Chip On Board, chip on board) assembly is an assembly process for mounting chips on a circuit board. After the chip is assembled on the circuit board, a cover needs to be fixed on the chip to protect it. . [0003] In the assembly process of assembling the cover on the chip, multiple assembling steps are required, that is, multiple assembling mechanisms are required to perform assembling operations on the cover or the chip respectively. The traditional assembly operation requires that each assembly mechanism corresponds to an operation station, that is, the cover or chip needs to be placed on a carrier and then assembled. After the assembly operation is completed, the transfer mechanism is used to transfer to the next operation station. The working platform and transmission mechanism occupy a large workin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H05K3/30
CPCH01L21/67121H05K3/30
Inventor 徐一华谷孝东张立光谢智寅曹葵康范林林周明
Owner TZTEK TECH