Flip chip packaging structure and processing technology method thereof

Abstract

The invention relates to a flip chip packaging structure and a processing technology method thereof, and the flip chip packaging structure comprises a substrate, a metal block, a surface mounting device, and a flip chip. The metal block, the surface mount device and the flip chip are connected with the upper surface of the substrate, a filling adhesive layer is arranged between the flip chip and the upper surface of the substrate, sealing adhesive layers are arranged on the peripheries of the metal block, the surface mounting device and the flip chip, and electromagnetic interference metal layers are arranged on the peripheries of the sealing adhesive layers. The flip chip packaging structure has the functions of heat dissipation, electromagnetic interference overall shielding and partial partition shielding at the same time, in addition, chip grinding is carried out in the packaging process, the overall thickness of the flip chip packaging structure is smaller than that of a traditional packaging product, the flip chip packaging structure better adapts to the light, thin, short and small development trend of the packaging product, and the requirement can be better met.

Description

technical field [0001] The invention relates to the technical field of flip-chip packaging, in particular to a flip-chip packaging structure and a processing method thereof. Background technique [0002] At present, there are roughly four steps in the existing EMI shielding flip chip packaging process. The first step is to mount the surface mount device (SMD) and the flip chip on the surface of the packaging substrate with the electromagnetic interference (EMI) shielding grounding pad. The second step The second step is to underfill the bottom of the flip chip. The third step is to seal the flip chip and surface mount device with non-conductive resin black glue. The fourth step is to implant solder balls and cut them into single pieces, then use the metal sputtering process on the product An electromagnetic interference metal layer is formed on the surface and surroundings to achieve the effect of anti-electromagnetic interference shielding; however, the existing electromagn...

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Problems solved by technology

[0002] At present, there are roughly four steps in the existing EMI shielding flip chip packaging process. The first step is to mount the surface mount device (SMD) and the flip chip on the surface of the packaging substrate with the electromagnetic interference (EMI) shielding grounding pad. The second step The second step is to underfill the bottom of the flip chip. The third step is to seal the flip chip and surface mount device with non-conductive resin black glue. The fourth step is to implant solder balls and cut them into single pieces, then use the metal sputtering process on the product An electromagnetic interference metal layer is formed on the surface and surroundings to achieve the effect of anti-electromagnetic interference shielding; however, the existing electromagnetic interference shielding flip-chip package products are designed inside the package substrate because the ground pad is designed, and the thickness of the package substrate is relatively thin (<0.2mm). After cutting a single piece, only the side is in contact with the EMI metal layer. Because the contact area is too small, there is a hidden danger of poor grounding, which cannot meet the demand.

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