Soaking structure and electronic equipment

Abstract

The invention discloses a soaking structure and electronic equipment, the soaking structure comprises a plate body, the plate body is provided with a heating area and a condensation area located on the periphery of the heating area, the heating area is used for being connected with a heating source, the plate body is provided with a plurality of capillary structures, and the plurality of capillary structures are radially distributed towards the condensation area by taking the heating area as the center; and a gas channel used for allowing gaseous working fluid to flow in the heating area and the condensation area is formed between every two adjacent capillary structures, each capillary structure comprises multiple sets of capillary units, and every two adjacent sets of capillary units are arranged at intervals to form a liquid channel used for allowing the working fluid to flow in the heating area and the condensation area. According to the soaking structure and the electronic equipment, the gas channels and the liquid channels can be arranged at intervals, the problem of interference of the working fluid in the liquid and gas phase change process is effectively prevented, the phase change of the working fluid is smoother, and therefore the heat dissipation rate of the soaking structure can be effectively increased, and the heat dissipation effect of the soaking structure is effectively improved.

Description

technical field [0001] The present application relates to the technical field of heat dissipation structures, in particular to a heat uniform structure and electronic equipment. Background technique [0002] With the development of science and technology, the processing functions of electronic devices in electronic equipment are becoming more and more powerful, and the power consumption and heat generation of electronic equipment are also increasing. In related technologies, in order to take into account the light and thin design of electronic equipment, VC (Vapor Chamber, vacuum chamber thermal structure heat dissipation technology) thermal structure is often used to dissipate heat from electronic devices (such as chips, batteries, etc.), the VC thermal structure mainly It includes an upper heat conduction sheet and a lower heat conduction sheet, a closed cavity is formed between the upper heat conduction sheet and the lower heat conduction sheet, and a plurality of channel...

AI Technical Summary

Problems solved by technology

However, since the working cavity is a closed cavity, the working fluid interferes with the phase transition process of liquid and gas in the closed cavity, which affects the heat conduction rate in the closed cavity, and then affects the heat dissipation effect of the heat-spreading structure.

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