A raw material mixing device for chemical copper plating solution preparation

Abstract

The invention discloses a raw material mixing device for chemical copper plating solution preparation, relates to the technical field of copper plating solution preparation, and comprises an outer tank body, a mixing inner tank capable of moving up and down is arranged inside the outer tank body, and the mixing inner tank The bottom end is provided with a liquid discharge pipe, and the connection between the liquid discharge pipe and the outer tank body is provided with a chute for the liquid discharge pipe to slide, and the inner bottom end of the mixing inner tank is provided with a pneumatic stirring mechanism for pneumatically stirring the raw materials , the inner top of the outer tank is hoisted with a spiral stirring mechanism for mechanically stirring raw materials. The present invention is scientific and reasonable, safe and convenient to use. The present invention is provided with a pneumatic stirring mechanism and a spiral stirring mechanism, and the pneumatic stirring mechanism can drive the spiral stirring mechanism Rotating, the spiral stirring mechanism does not require an additional power source, and can realize the superposition of gas stirring and mixing and mechanical stirring and mixing, which improves the mixing effect of chemical copper plating solution raw materials and makes the chemical copper plating solution raw materials mix more fully.

Description

Technical field [0001] The present invention relates to a copper plating solution was prepared technical field, particularly a feedstock chemical copper plating solution was prepared by mixing apparatus. Background technique [0002] Chemical copper plating solution is an industry for special liquids, PTH having a fast, high stability, wide operating temperature range and concentration of the solution, etc., is widely used a copper layer and a metal plating, copper plating such that after dense, bright copper coating has a color, for all the basic copper metal and non-metallic surfaces; [0003] Preparation of the copper plating solution for electroless copper agents need to use a high-speed A agent, B agent PTH deionized or tap water and configured in a certain mixing ratio, during the mixing arranged in the copper plating solution, the feedstock often requires the use of the mixing device mixing, a conventional copper plating solution of the following problems feedstock mixing ...

AI Technical Summary

Problems solved by technology

[0004] 1. It is necessary to use the motor as the driving power source to stir the mixed raw materials. The failure rate is high, and the frequent start and stop of the motor will not only cause damage to the motor, but also waste a lot of electric energy;

[0005] 2. The method of stirring with pure gas will reduce the mixing effect of raw materials and affect the performance of copper plating solution after preparation;

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