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Method and device for preparing superfine copper powder

A technology of ultra-fine copper powder and copper oxide, which is applied in separation methods, combined devices, chemical instruments and methods, etc. flow etc.

Pending Publication Date: 2021-09-03
INST OF PROCESS ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of instantaneous loss of flow during reduction and sintering of ultra-fine copper oxides, resulting in low purity of ultra-fine copper powder and sintering of primary particle size, and proposes a two-stage process of low-temperature pre-reduction-high-temperature deep reduction process
(4) The added inert particles are relatively large, and the collision and friction between the inert particles and the wall can prevent the viscous nano-copper from adhering to the distribution plate and the wall of the fluidized bed, overcoming the traditional ultrafine powder processing During the process, it is difficult to discharge due to the adhesion of raw materials or products

Method used

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  • Method and device for preparing superfine copper powder
  • Method and device for preparing superfine copper powder
  • Method and device for preparing superfine copper powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Nano-copper oxide powder (particle size 110nm) enters the cyclone preheater 4 to preheat to 250°C through the vibrating feeder 2 and the airflow conveying device 3, and sends it into the first fluidization through the first feed valve 5 and the riser 6. The bed reactor 7 is in contact with the first fluidized bed carrier gas PG1 from the bottom of the first fluidized bed reactor 7 and undergoes a reduction reaction, the reaction temperature is 210° C., and the superficial gas velocity of the carrier gas is 1 m / s, Reducing gas H 2 The volume concentration is 10%, and the contact method is countercurrent, so that the material is in a bubbling fluidized state. The residence time of the material in the first fluidized bed reactor 7 is 20min, so that the conversion rate of the copper oxide after the reaction in the first fluidized bed reactor is about 70%; Bed reactor 9; tail gas is discharged through the outlet of the first cyclone separator 13, and enters the combustion c...

Embodiment 2

[0058] Nano-copper oxide powder (particle size 120nm) enters the cyclone preheater 4 to preheat to 200°C through the vibrating feeder 2 and the air conveying device 3, and sends it into the first fluidization through the first feed valve 5 and the riser 6. The bed reactor 7 is in contact with the first fluidized bed carrier gas PG1 from the bottom of the first fluidized bed reactor 7 and undergoes a reduction reaction, the reaction temperature is 180°C, and the superficial gas velocity of the carrier gas is 0.5m / s , the reducing gas H 2 The volume concentration is 30%, and the contact method is countercurrent, so that the material is in a bubbling fluidized state. The residence time of the material in the first fluidized bed reactor 7 is 3min, so that the conversion rate of the copper oxide after the reaction in the first fluidized bed reactor is about 70%; Bed reactor 9; tail gas is discharged through the outlet of the first cyclone separator 13, and enters the combustion ch...

Embodiment 3

[0060] Ultrafine copper oxide powder (particle size 1-2μm) enters the cyclone preheater 4 to preheat to 200°C through the vibrating feeder 2 and the air conveying device 3, and sends it into the first feed valve 5 and the riser 6 into the first The fluidized bed reactor 7 is in contact with the first fluidized bed carrier gas PG1 from the bottom of the first fluidized bed reactor 7 and undergoes a reduction reaction. The reaction temperature is 150° C., and the superficial gas velocity of the carrier gas is 0.1 m / s, reducing gas H 2 The volume concentration is 20%, and the contact method is cross-flow, so that the material is in a bubbling fluidized state. The residence time of the material in the first fluidized bed reactor 7 is 60min, so that the conversion rate of copper oxide after the reaction in the first fluidized bed reactor is about 80%; Bed reactor 9; tail gas is discharged through the outlet of the first cyclone separator 13, and enters the combustion chamber 15 bu...

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Abstract

The invention discloses a method and device for preparing superfine copper powder. According to the method, superfine copper oxide is subjected to powder preheating, two-stage method reduction, cooling and surface treatment, and the superfine copper powder is obtained. The device comprises a first fluidized bed reactor and a second fluidized bed reactor which are connected in sequence. According to the method and the device, the two processes of low-temperature pre-reduction and high-temperature deep reduction are adopted, so that particle sintering can be prevented, uniform and rapid fluidization of particles is achieved, the purity of the prepared superfine copper powder reaches 99% or above, and the primary particle size of the copper powder is evenly distributed within the range of 50-200 nm.

Description

technical field [0001] The invention belongs to the technical field of ultrafine powder preparation, and relates to a method and a device for preparing ultrafine copper powder. Background technique [0002] Ultrafine copper powder (particle size<1μm) has good electrical conductivity, catalytic activity, lubricity and color, and can be widely used in powder metallurgy, conductive paste, hydrogenation / dehydrogenation catalyst, grease additive and other fields. Metal copper with nanometer size has a higher specific surface area than micron-sized metal copper powder, strong activity, good dispersion, purple-red color, and excellent performance. [0003] At present, the methods for preparing ultrafine copper powder include physical methods and chemical methods. Physical methods include high-energy ball milling, spraying, and evaporation condensation, and chemical methods include electrodeposition and liquid phase reduction. (1) high-energy ball milling method, such as CN1025...

Claims

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Application Information

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IPC IPC(8): B22F9/22B01J8/26B01D50/00
CPCB22F9/22B01J8/26B22F2301/10
Inventor 李军朱庆山张旭李洪钟
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI
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