Substrate OIS magnetomotive mechanism and camera module employing same
A camera module and magnetic technology, which is applied to the structure of telephones, image communications, and devices with sensors, etc., can solve the problems of large internal space occupation, complicated manufacturing process, and low yield rate, and achieve the effect of reducing the overall height
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Embodiment 1
[0051] This embodiment discloses a substrate OIS magnetic mechanism, which is installed in a sensor 8 anti-shake camera module to adjust the assembly sequence of internal mechanisms, thereby reducing the thickness of the entire camera module.
[0052] Specifically, as Figure 6-9 As shown, the main two components are shown, namely the OIS base 4 and the bottom cover 6, the bottom cover 6 is the bottom baffle of the whole camera module, and the circuits and sensors 8 in the prior art are all arranged at this position, due to the wiring More, multi-layer structure design is often used in the prior art, which will inevitably lead to greater difficulty in assembly.
[0053] Wherein the OIS base 4 is movably connected with the camera module, and the sensor 8 is arranged on the OIS base 4; a plurality of coils 11 are arranged on the OIS base 4, and an OIS magnet 9 corresponding to the coils 11 is fixed in the camera. The OIS base 4 is used to support the components of the sensor 8 ...
Embodiment 2
[0059] This embodiment discloses a camera module structure, which has the fixing structure of the suspended image sensor 8 in the first embodiment.
[0060] Specifically, the camera module is designed for the sensor 8 anti-shake structure, such as Figure 1-4 as shown, Figure 4 The dismantling structure diagram of the dismantling structure is not sequentially disassembled according to the covering order of the structure, so it should be noted that the exterior of the entire camera module is composed of the outer shell 1 and the bottom cover 6, and the bottom cover 6 is a single board structure, which is fastened on the On the bottom opening of the housing 1.
[0061] The main functional components in the casing 1 include the AF module 2 , the sensor 8 and the above-mentioned suspended fixed structure. The sensor 8 is arranged on the OIS base 4 and a protective cover 5 is arranged on the sensor 8 . The AF module 2 is placed on the casing 1, and a separate FPC cable is provid...
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