Semiconductor process execution method

Abstract

The invention provides a semiconductor process execution method, which comprises the following steps: obtaining a process formula corresponding to a semiconductor process, wherein the process formula is in a plain text format and comprises a hardware instruction and a process flow instruction, the hardware instruction and the process flow instruction are character strings, the hardware instruction is used for controlling semiconductor process equipment to execute process steps of the semiconductor process, and the process flow instruction is used for controlling the process flow of the semiconductor process; compiling the process formula into a process execution linked list; and controlling the semiconductor process equipment to execute the semiconductor process according to the process execution linked list. According to the technical scheme of the invention, the hardware instruction and the technological process instruction are in the form of character strings, and particularly the formed technological formula can be stored in the form of plain text, so that the editing difficulty of the technological formula is reduced, the editing efficiency of the technological formula is improved, and the applicability of the technological formula is improved.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, and in particular, to a method for executing a semiconductor technology. Background technique [0002] The conventional process flow of crystalline silicon solar cell manufacturing mainly includes slicing, texturing, diffusion, etching, coating, silk screen printing, sintering, testing and sorting and other processes. In the production process of crystalline silicon solar cells, diffusion and coating processes are the key to improving the quality and efficiency of cells. Due to the continuous optimization of the process flow of the diffusion and coating process, it is necessary for the process equipment to continuously improve the process of editing and executing the process formula to meet the requirements of the production process. In the actual diffusion and coating production line, the process gas paths of different customer products have certain differences, and customers hav...

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Problems solved by technology

[0004]However, the data storage space corresponding to each process step is limited, the data structure is relatively fixed, and there is an upper limit for the number of added parameters, which limits the product expansion space and modifies the process For a certain parameter of the formula, it is necessary to modify and modify the value of the parameter corresponding to each step, and since the process formula file is stored in the binary form of the process step data structure, the staff can only use special equipment software to view and edit. Causes inefficiencies in modifying process recipes

In addition, since each process step corresponds to all hardware parameters involved in the semiconductor process, even if some hardware parameters of the current step are exactly the same as those of the previous step, the control links involved in these hardware parameters still need to be repeated during software execution. Execute once, recipe execution is inefficient

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