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High-power semiconductor device with heat dissipation function

A semiconductor, high-power technology, used in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of insulation pressure plate breakage and reduction of compression support structures.

Pending Publication Date: 2021-09-10
刘卫
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] High-power semiconductor devices with heat dissipation usually only have fixing holes at the center of the insulating plate, which reduces the compression support structure between the insulating plate and the thermal pad to a certain extent, and the device is installed on the insulating plate. During the welding between the welding, the welding pressure acts on the insulating pressing plate, and the insulating pressing plate will break if the pressure is too high

Method used

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  • High-power semiconductor device with heat dissipation function
  • High-power semiconductor device with heat dissipation function
  • High-power semiconductor device with heat dissipation function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] see Figure 1-Figure 5 , a high-power semiconductor device with heat dissipation, its structure includes a circuit board 1, a regulator 2, a heat sink 3, a heat sink 4, the bottom of the heat sink 4 is provided with a heat sink 3, and the heat sink 3 is connected to the heat sink The body 4 is movably connected, and the regulator 2 is provided with a circuit board 1, and the circuit board 1 and the regulator 2 are in clearance fit;

[0028] The regulator 2 is provided with a thermal pad 2a, an operator 2b, a mounting seat 2c, a pin 2d, a fastener 2e, and a semiconductor 2f, and the semiconductor 2f is provided with a pin 2d, and the pin 2d is connected to the semiconductor 2f. The central position of the operator 2b is provided with a fastener 2e, the fastener 2e is in clearance fit with the operator 2b, the semiconductor 2f is installed on the heat conduction pad 2a, and the heat conduction pad 2a and the semiconductor 2f The manipulator 2b is provided with a mounting...

Embodiment 2

[0036] see Figure 1-Figure 6 , a high-power semiconductor device with heat dissipation, its structure includes a circuit board 1, a regulator 2, a heat sink 3, a heat sink 4, the bottom of the heat sink 4 is provided with a heat sink 3, and the heat sink 3 is connected to the heat sink The body 4 is movably connected, and the regulator 2 is provided with a circuit board 1, and the circuit board 1 and the regulator 2 are in clearance fit;

[0037] The regulator 2 is provided with a thermal pad 2a, an operator 2b, a mounting seat 2c, a pin 2d, a fastener 2e, and a semiconductor 2f, and the semiconductor 2f is provided with a pin 2d, and the pin 2d is connected to the semiconductor 2f. The central position of the operator 2b is provided with a fastener 2e, the fastener 2e is in clearance fit with the operator 2b, the semiconductor 2f is installed on the heat conduction pad 2a, and the heat conduction pad 2a and the semiconductor 2f The manipulator 2b is provided with a mounting...

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Abstract

The invention discloses a high-power semiconductor device with a heat dissipation function. The high-power semiconductor device structurally comprises a circuit board, a regulator, a heat dissipation sheet and a heat dissipation body, wherein the heat dissipation sheet is arranged at the bottom of the heat dissipation body and movably connected with the heat dissipation body, the circuit board is arranged on the regulator, the circuit board is in clearance fit with the regulator, the regulator is provided with a heat conduction pad, an operator, a mounting seat, a pin, a fastener and a semiconductor, the semiconductor is provided with the pin, the pin is connected with the semiconductor, and the fastener is arranged in the center of the operator. According to the invention, a supporting device is supported between an insulating pressing plate and a heat conduction pad so as to add the pressing supporting body of the insulating pressing plate and an electric heating plate, so that the insulating pressing plate and the heat conduction pad are connected more stably; and an attaching device on the supporting device can be further buckled on the heat conduction pad in an abutting mode, so that when the device is assembled, the insulating pressing plate and the heat conduction pad can be pressed more tightly in an attaching mode.

Description

technical field [0001] The invention relates to the field of high-power semiconductor devices, in particular to a high-power semiconductor device with heat dissipation. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. Power semiconductor devices usually have heat sinks; [0003] High-power semiconductor devices with heat dissipation usually only have fixing holes at the center of the insulating plate, which reduces the compression support structure between the insulating plate and the thermal pad to a certain extent, and the device is mounted on the insulating plate. During the welding between the welding, the welding pressure acts on the insulating pressing plate, and the ins...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/42H01L23/40H01L23/367H01L23/10
CPCH01L23/42H01L23/40H01L23/3672H01L23/10
Inventor 刘卫
Owner 刘卫
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