High-speed back plate assembly

Abstract

The invention relates to the technical field of back plates, in particular to a high-speed back plate assembly, and adopts the technical scheme that the high-speed back plate assembly comprises a back plate, a fixing groove formed in the top end of the back plate and jacks uniformly distributed and communicated below the fixing groove, and further comprises electromagnetic rings fixedly arranged in the middle upper parts of the jacks, and insulating layers are arranged on the inner walls of the electromagnetic rings; the elastic contact assemblies are symmetrically arranged on the two sides of the lower portions of the jacks, the connecting assemblies are evenly distributed in the back plate, the connecting assemblies are arranged below the position between every two adjacent sets of jacks, the heat dissipation assembly is fixedly installed on one side of the lower portion of the back plate, and the electromagnetic block is obliquely and fixedly installed in the bottom end of the side, close to the heat dissipation assembly, of the back plate. The top end of the electromagnetic block is electrically connected with the electromagnetic ring. According to the invention, the connector is provided with the connecting assembly and the elastic contact assembly, whether the connector is installed in place can be detected, and the arranged electromagnetic ring not only can fix the end of the connector, but also can enable the electromagnetic block to drive the heat dissipation assembly to work so as to carry out heat dissipation treatment on the backboard.

Description

technical field [0001] The invention relates to the technical field of backplanes, in particular to high-speed backplane components. Background technique [0002] The high-speed backplane is a kind of PCB board, but it is different from the ordinary PCB board. The high-speed backplane provides signal interconnection channels for various types of sub-cards in the system, provides interfaces for the power supply of the system, and cooperates with the chassis structure. Each sub-card or module serves as an auxiliary physical support. [0003] The backplane needs to be installed with a connector when it is in use, but at present, when the connector is installed on the backplane, the detection device cannot be used to detect whether the connector is installed in place, and the detection device cannot detect whether the end of the connector is installed in place, and the connector will appear After soldering on the backplane, it may cause failure due to improper installation, and...

AI Technical Summary

Problems solved by technology

[0005] To this end, the present invention provides a high-speed backplane assembly, which abuts against the connector end through the elastic contact assembly, and then detects whether the connector end is installed in place through the contact head of the detection device and the elastic contact assembly, and connects the adjacent two A group of elastic contact components are connected, and then the detection device can detect whether the connector as a whole is detected in place, and the electromagnetic ring set can not only attract and fix the connector end, so as to avoid the occurrence of weak contact force between the backplane and the connector end Poor contact, at the same time, the electromagnetic ring can make the electromagnetic block have a magnetic driving heat dissipation component through the wire to work for the backplane to dissipate heat. When it is installed, the detection device cannot be used to detect whether the connector is installed in place, and the detection device cannot be used to detect whether the end of the connector is installed in place. There will be a phenomenon that the connector is soldered to the backplane due to improper installation, resulting in a malfunction, and the backplane is in place. When in use, a lot of heat will be generated, and the heat dissipation of the backplane is slow

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