Thermal print head and method of making the same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- POSTEK ELECTRONICS
- Publication Date
- 2022-07-01
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of printing, in particular to a thermal printing head and a manufacturing method thereof. Background technique
[0002] The thermal print head includes components such as a heat sink, a ceramic substrate, a PCB printed circuit board, and a driver IC. A glass glaze layer is prepared on the ceramic substrate as a heat storage layer, and the upper part of the heat storage layer is respectively covered with a resistance layer, an electrode layer and a protective layer. As a well-known thermal print head, it is generally classified into a thin film type thermal print head and a thick film type thermal print head.
[0003] figure 1 A schematic diagram of an embodiment of an existing thin-film type thermal print head is shown, figure 2 show figure 1 A cross-sectional view taken along the line A-A of the thin-film thermal printhead shown. The thin film type thermal print head 100 includes an insulating substra...