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Chip system simulating i2c protocol to realize transmission of ADC acquisition data

A technology for data collection and protocol implementation, which is applied in electrical digital data processing, application of thermometers, measuring devices, etc. It can solve the problems of not supporting i2c protocol, X1000E has no communication interface, lack of ADC related support, etc.

Pending Publication Date: 2021-09-14
北京君正集成电路股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing chips such as the X1000E chip support i2c interface devices but lack the support of ADC. ADC is a necessary interface for printers and needs to detect peripherals such as print head temperature.
In order to solve this problem, a low-cost MCU chip HR7p153 needs to be connected to expand the ADC related interface, but HR7p153 does not support the i2c protocol, and there is a technical defect that there is no communication interface with X1000E

Method used

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  • Chip system simulating i2c protocol to realize transmission of ADC acquisition data
  • Chip system simulating i2c protocol to realize transmission of ADC acquisition data

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Embodiment Construction

[0027] Currently, technical terms commonly used in the art include:

[0028] GPIO: General input and output is abbreviated.

[0029] CPU: Central Processing Unit is a large-scale integrated circuit that is a computer's calculation core (Core) and control core. (CONTROL Unit). Its function is mainly to explain the computer instruction and the data in the computer software.

[0030] MCU: MicroController Unit, also known as a single chip microcomputer (single chip microcomputer, is appropriately reduced by the frequency and specifications of the central processor (CPU), Memory, The peripheral interface such as the counter, USB, A / D conversion, UART, PLC, DMA, even the LCD drive circuit is integrated on a single chip, forming a chip-level computer, and performs different combinations of different applications.

[0031] like figure 1 As shown, the present invention relates to a chip system that simulates an I2C protocol implementation transmitting ADC acquisition data, the system com...

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Abstract

The invention provides a chip system for transmitting ADC acquisition data by simulating an i2c protocol, which comprises an MCU chip for expanding ADC related interfaces of a main chip and simulating an i2c communication protocol through two GPIO pins; a CPU of the main chip, which is used for collecting temperature data through the MCU, wherein the CPU transmits a clock signal to the MCU through one pin of an i2c communication protocol simulated by the MCU, after the MCU captures the clock signal, a confirmation message is sent to the main chip, after the main chip confirms MCU information, ADC data are started to be read, and the MCU sends the collected data to the main chip in a GPIO simulation waveform mode; and after the main chip receives the ADC data, the data are sent to the printer program module for processing.

Description

Technical field [0001] The present invention relates to the field of printers, and in particular, to an analog I2C protocol implements a chip system for transmitting ADC acquisition data. Background technique [0002] With the continuous development of technology, more and more electronic products appear in people's daily lives. Thermal Ticket Printer is a common printer device, which is usually based on a single-chip microcomputer to control the printhead to implement the print function. Thermal Ticket Printer is a common printer device, which is usually based on a single-chip microcomputer to control the printhead to implement the print function. For example, Beijing Junzheng X1000E chip is a chip in the field of Internet of Things. It is aiming at the printer driver based on Junzheng chips for the thermal printer market. However, the X1000E chip lacks the relevant support of the ADC, and the ADC is an essential interface that needs to detect the printhead temperature, paper te...

Claims

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Application Information

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IPC IPC(8): G06F13/38G06F13/42G01K13/00B41J2/32
CPCG06F13/382G06F13/4282G01K13/00B41J2/32G06F2213/0016G06F2213/3852Y02D10/00
Inventor 高见
Owner 北京君正集成电路股份有限公司