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An embedded microfluidic printed circuit board compatible with various blind slots and its preparation method

A printed circuit board, micro-channel technology, applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., to achieve efficient and uniform heat dissipation, reduce transmission loss and standing waves, and uniform heat dissipation.

Active Publication Date: 2022-04-12
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims to provide a printed circuit board with embedded microfluidic channels compatible with various blind slots and its preparation method, so as to solve the technical problem of how to realize efficient and uniform heat dissipation of different chips while meeting microwave performance requirements

Method used

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  • An embedded microfluidic printed circuit board compatible with various blind slots and its preparation method
  • An embedded microfluidic printed circuit board compatible with various blind slots and its preparation method
  • An embedded microfluidic printed circuit board compatible with various blind slots and its preparation method

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Experimental program
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Embodiment

[0060] Such as figure 1 As shown, this embodiment proposes a printed circuit board 3 with embedded micro-channels compatible with various blind slots, including a metal core board 1 with embedded micro-channels 2, and multi-layer metal circuit layers located on both sides of the metal core board. 4 and the insulating medium layer 5, and a variety of heat dissipation blind slots with openings facing the surface metal circuit layer; the first heat dissipation blind slot 6, the second heat dissipation blind slot 7 and the third heat dissipation blind slot 8 are included. The present invention sets multiple heat dissipation blind slots to simultaneously meet heat dissipation demands of chips with different powers and thicknesses. Further, the insulating dielectric layer 5 is jointly composed of the dielectric layer of the prepreg 10 and the copper clad laminate 14 .

[0061] Such as figure 2 As shown, the material of the metal core plate 1 embedded with the micro-channel 2 is c...

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Abstract

The invention provides an embedded micro-channel printed circuit board compatible with various blind slots and a preparation method thereof. The embedded micro-channel printed circuit board compatible with various blind slots includes a metal embedded micro-channel The core board, the multi-layer metal circuit layer and insulating medium layer located on both sides of the metal core board, and a variety of heat dissipation blind slots with openings facing the surface metal circuit layer; the first heat dissipation blind slot, the second heat dissipation blind slot and the third heat dissipation blind slot The heat dissipation blind slots, the first heat dissipation blind slots can meet the integration requirements of thick chips; the second heat dissipation blind slots can meet the integration requirements of high power and thin chips; the third heat dissipation blind slots can meet the requirements of medium power, thin Chip integration requirements. The invention embeds a metal core board embedded with a micro-flow channel in the printed circuit board and arranges a variety of heat dissipation blind slots, which can realize efficient and uniform heat dissipation of different chips and meet microwave performance requirements at the same time.

Description

technical field [0001] The invention relates to the technical field of microelectronic heat dissipation, in particular to a printed circuit board with embedded micro-channels compatible with various blind slots and a preparation method thereof. Background technique [0002] With the rapid development of electronic equipment in the direction of multi-function and miniaturization, the system integration density continues to increase, the power density gradually increases, and the heat generated by electronic devices also increases sharply. High requirements to ensure that the system works properly within a suitable temperature range. Traditional printed circuit boards are mainly composed of organic materials and copper wiring layer materials. Due to the low thermal conductivity of organic materials (usually <1W / m·K), it is difficult to meet high heat dissipation requirements. [0003] Combining micro-channel heat dissipation technology with printed circuit board integratio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0213H05K1/0203H05K3/00H05K3/0044
Inventor 徐诺心张剑边方胜曾策戴广乾龚小林卢军蒋瑶珮徐榕青谢国平
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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