Vertical heating furnace

A heating furnace and vertical technology, applied in the field of circuit board processing equipment, can solve the problems of low heating efficiency and small heating capacity, and achieve the effect of improving heating efficiency, increasing quantity, and increasing storage quantity

Pending Publication Date: 2021-09-21
SHENZHEN DC AUTOMATION EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, one of the objectives of the present invention is to provide a vertical heating furnace to solve the technical problem of low heating efficiency caused by the small heating capacity of the existing heating furnace

Method used

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Embodiment Construction

[0033] Below, combined with figure 1 to attach Figure 9 As well as specific embodiments, the present invention will be further described. It should be noted that, on the premise of not conflicting, the various embodiments or technical features described below can be combined arbitrarily to form new embodiments.

[0034] It is mentioned in this article that "A and B are respectively connected (set, set, fixed) to C and D", which should be understood as including "A is connected (set, set, fixed) to C, B is connected (set, set, fixed) "Set at, set at, fixed at) D" also includes "A is connected (set, set at, fixed at) D, B is connected (set, set at, fixed at) C". For example, the technical content described below "the upper and lower parts of the heating box 11 are respectively provided with a material inlet 11a and a material outlet 11b", which includes the technical content "the upper part of the heating box 11 is provided with a material inlet 11a, and the heating box 11 Th...

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Abstract

The invention provides a vertical heating furnace. The vertical heating furnace comprises: a heating box, a feeding mechanism and a discharging mechanism, wherein the heating box comprises a heating box body, a hot air box, and a vertical material tray arranged in the heating box body and used for storing materials; a feeding hole and a discharging hole are separately formed in the upper part and the lower part of the heating box body; the hot air box is arranged in the heating box body and used for supplying hot air to the vertical material tray; the feeding mechanism is arranged at the feeding hole of the heating box and is used for pushing the materials to move from the feeding hole to the vertical material tray; and the discharging mechanism is arranged at the discharging hole of the heating box and used for pushing the materials on the vertical material tray to be discharged from the discharging hole. A large number of circuit boards are stored through the vertical material tray, so that the number of the circuit boards heated in the heating box at the same time is increased, and the heating efficiency is improved. The circuit boards are plate-shaped materials, the circuit boards can be stacked on the vertical material tray at intervals layer by layer in the vertical direction, and the plate-shaped structures of the circuit boards are matched with the vertical material tray, so that the storage number of the circuit boards is further increased.

Description

technical field [0001] The invention relates to the field of circuit board processing equipment, in particular to a vertical heating furnace. Background technique [0002] PCB board (Printed Circuit Board, printed circuit board), also known as integrated circuit board, referred to as circuit board for short, PCB board adopts electronic printing technology, integrates electronic components on the substrate, is an important part of electronic equipment, and is extremely widely used. widely. The PCB board manufacturing process involves the heating or drying process of the PCB board, such as coating glue curing, moisture drying, etc. Therefore, heating furnaces are often used in the processing technology of PCB boards. In the molding process of PCB boards in the prior art, the heating capacity of the curing furnace is too small, only one circuit board can be heated, and the heating efficiency is low. Contents of the invention [0003] In order to overcome the deficiencies o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27B1/20F27B1/21F27D3/12H05K3/22
CPCF27B1/20F27B1/21F27D3/12H05K3/227
Inventor 何毅祝宜君李谆谆
Owner SHENZHEN DC AUTOMATION EQUIP
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