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Substrate cutting method and device

A cutting method and substrate technology, which can be used in manufacturing tools, electro-solid devices, laser welding equipment, etc., can solve the problem of water vapor infiltration of multi-layer PI structures, and achieve the effect of improving the level of industrial technology, avoiding water vapor infiltration, and avoiding pulling.

Inactive Publication Date: 2021-09-24
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention provides a substrate cutting method and device, which are used to solve the problems derived from the multi-layer PI structure infiltrating water vapor in the existing substrate cutting technology

Method used

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  • Substrate cutting method and device
  • Substrate cutting method and device

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0025] In the description herein, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invent...

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Abstract

The invention provides a substrate cutting method and device, the substrate comprises a rigid plate and a flexible polyimide laminate on the rigid plate, the substrate cutting method comprises the following steps: laser is configured to cut the flexible polyimide laminate along a predetermined trace, so that the flexible polyimide laminate is separated along the predetermined trace; and a cutter is configured to cut the rigid plate along the preset trace, so that the rigid plate is separated along the preset trace. Therefore, a cross section fusion bonding structure is formed in the flexible polyimide laminate along the predetermined trace, and the problem that in the prior art, water vapor permeates into an interlayer interface when a cutter wheel is used for cutting a polyimide material layer is effectively solved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate cutting method and device using laser cutting polyimide. Background technique [0002] Flexible screens have the advantages of thinness, flexibility, drop resistance and foldability, and have gradually become an important product for R&D and production. [0003] In the related manufacturing process of flexible screens, in addition to the difficulty of polyimide (PI) coating, film adhesion, reliability and stress, etc. need to be considered in the manufacture of flexible substrates. It should be noted that the flexible substrate includes a multi-layer PI structure, and the prior art uses a knife wheel to cut the multi-layer PI structure, so that different layers in the multi-layer PI structure are pulled to different degrees, resulting in interlayer interfaces Infiltration of water vapor is prone to delamination of PI substrates, resulting in reduced product yield. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/683B23K26/402B23K26/38
CPCH01L21/78B23K26/38B23K26/402H01L21/6836H01L2221/68354
Inventor 李柱辉
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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