Circuit board and preparation method thereof
A technology of circuit boards and circuit layers, which is applied in the fields of printed circuit manufacturing, printed circuits, circuit heating devices, etc., can solve the problems of insufficient bonding force between insulating substrate and copper layer, affecting product quality, and easy detachment of copper layer, etc., to achieve good Heat conduction effect, convenient etching, and precise etching effect
Pending Publication Date: 2021-09-24
江西鸿美新能源科技有限公司
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Problems solved by technology
However, the bonding force between the insulating substrate and the copper layer obtained by this manufacturing method is insufficient, causing the copper layer to be easily detached, thereby affecting the quality of the product
Method used
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[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0035] The invention provides a method for preparing a circuit board, comprising the steps of:
[0036] (1) Provide a carrier layer, prepare a conductive copper layer on the surface of the carrier layer, the carrier layer includes a substrate layer and a peeling layer prepared on the surface of the substrate layer, prepare a conductive copper layer on the surface of the peeling layer, and perform etching on the conductive copper layer , forming a circuit layer;
[0037] (2) The carrier lay...
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The invention discloses a preparation method ofa circuit board, and thepreparation methodcomprises the following steps of (1) preparing a conductive copper layer on the surface of a carrier layer which comprises a base material layer and a stripping layer, preparing the conductive copper layer on the surface of the stripping layer, and etching the conductive copper layer to form a circuit layer; (2) forming a feeding roll by the carrier layer and the circuit layer; and (3) feeding the heat-conducting glue solution into the surface of the feeding roll conveyed by a first unwinding device, drying the heat-conducting glue solution by a drying device, attaching the heat-conducting glue solution to the feeding roll conveyed by a second unwinding device, enabling the two feeding rolls and the heat-conducting glue solution between the two feeding rolls to enter the space between the two hot-pressing devices together, forming an insulating layer after hot-pressing, stripping the carrier layer, and preparing a thickened copper layer on the surface of the circuit layer. According to the process, a copper-clad board with a thinner copper layer can be realized, the thin copper is prevented from being easily broken due to tension, etching is accurate, the circuit board with a narrower line width can be obtained; the binding force between the copper layer and the insulating layer can be improved, and the circuit board with good heat dissipation can be obtained; the process is simple, the cost is low, and the production efficiency and the yield can be improved.
Description
technical field [0001] The invention relates to the technical field of circuit board preparation, and more particularly relates to a circuit board with heat dissipation effect and a preparation method thereof. Background technique [0002] PCB (printed circuit board) is a printed circuit board, referred to as a printed board, and is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to make the electrical interconnection between various components, printed circuit boards must be used. plate. The printed circuit board is composed of an insulating base plate, connecting wires and pads for assembling and welding electronic components, and has the dual functions of a conductive line and an insulating base plate. It can r...
Claims
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IPC IPC(8): H05K3/38H05K3/02H05K1/02
CPCH05K3/38H05K3/02H05K1/02H05K1/0201
Inventor 李金明
Owner 江西鸿美新能源科技有限公司