A kind of lead-free solder paste production device
A technology of lead-free solder paste and production equipment, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problem of low dispersion, achieve the effect of strengthening and improving the mixing effect
Active Publication Date: 2022-04-08
YIK SHING TAT SOLDER MFR KUNSHAN
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Problems solved by technology
In the production process of lead-free solder paste, silver powder and copper powder are doped into liquid tin in related technologies, but silver powder and copper powder themselves have relatively large particle sizes, so when mixing and preparing lead-free solder paste , silver powder and copper powder can no longer be changed into smaller particles, which will lead to low dispersion of silver powder and copper powder in lead-free solder paste, so the dispersion of copper and silver in lead-free solder paste needs to be further improved improve
Method used
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Embodiment Construction
[0029] The following is attached Figure 1-3 The application is described in further detail.
[0030] The embodiment of the present application discloses a lead-free solder paste production device. refer to figure 1 and figure 2 , a lead-free solder paste production device includes a kettle body 1, the top of the kettle body 1 is pierced with a stirring shaft 2, the stirring shaft 2 can rotate relative to the kettle body 1, and the stirring shaft 2 is located at one end of the kettle body 1 There are several stirring blades 3, and a motor 4 is provided on the top of the kettle body 1. The output shaft of the motor 4 is connected to the stirring shaft 2. When the motor 4 works, it will drive the stirring shaft 2 to rotate, and the stirring shaft 2 will drive the stirring blade 3 to rotate. , the stirring blade 3 will mix and stir various raw materials placed in the kettle body 1 for preparing lead-free solder paste. There are also a number of stirring balls 5 inside the ke...
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The present application relates to the field of solder paste preparation equipment, in particular to a lead-free solder paste production device, which includes a kettle body, a heating box is arranged on the top surface of the kettle body, and a liquid storage tank is connected to the bottom of the heating box. The liquid storage pipe is connected to the kettle body. Both ends of the liquid storage pipe are provided with high-temperature valves. There is a liquid diffuser plate, and a heating assembly for heating the heating box is also arranged on the heating box. The heating box provided on the kettle body of the present application can heat the metal raw materials of the lead-free solder paste, so that the metal raw materials are melted and then mixed, which effectively strengthens the mixing effect of the metal raw materials. When using a liquid plate, the liquid diffuser will break up the metal liquid, further improving the mixing effect of the two reactants in the lead-free solder paste.
Description
technical field [0001] The present application relates to the field of solder paste preparation equipment, in particular to a lead-free solder paste production device. Background technique [0002] Solder paste is a new type of soldering material that emerged with surface mount technology. Solder paste is a complex system, a creamy mixture formed by mixing solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the components to be soldered and the printed circuit pads will be welded together. Form a permanent connection. [0003] Traditional solder paste is mainly composed of tin and lead, but the lead element is highly toxic, and it will also cause great pollution to the environment when discharged into the environment. Therefore, in the related art, copper and silver...
Claims
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IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 陈庆辉吴建新吴达铖吴建雄
Owner YIK SHING TAT SOLDER MFR KUNSHAN