A test fixture for the bonding force of the metal layer after the chip manufacturing evaporation process
A test fixture and bonding force technology, used in semiconductor/solid-state device testing/measurement, measurement devices, and mechanical devices, etc., can solve problems such as wafer scrap detection accuracy, ensure accuracy, reduce extrusion times, Avoid wasteful effects
Active Publication Date: 2021-11-26
江苏晟驰微电子有限公司
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Problems solved by technology
[0006] For this reason, the present invention provides a test fixture for the bonding force of the metal layer after the chip manufacturing evaporation process, to overcome the direct scrapping of the wafer and the low detection accuracy caused by the insufficient metal bonding force after the wafer is cut in the prior art The problem
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[0057] In order to make the objects and advantages of the present invention clearer, the present invention will be further described below in conjunction with the examples; it should be understood that the specific examples described here are only for explaining the present invention, and are not intended to limit the present invention.
[0058] Preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present invention, and are not intended to limit the protection scope of the present invention.
[0059] It should be noted that, in the description of the present invention, terms such as "upper", "lower", "left", "right", "inner", "outer" and other indicated directions or positional relationships are based on the terms shown in the accompanying drawings. The direction or positional relationship shown is ...
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The invention relates to a test fixture for the bonding force of a metal layer after the evaporation process of chip manufacturing, including a blue film pasting mechanism for pasting the blue film, which includes a blue film fixing part and a wafer fixing mechanism for fixing the wafer. A circle, which includes a wafer fixed plate, a blue film extrusion mechanism, used to squeeze the blue film, which includes a sliding part and a pressing part, the pressing part is fixedly connected to the sliding part, and a manipulator is used to To tear off the pasted blue film, the central control unit is connected with the blue film pasting mechanism, wafer fixing mechanism, blue film extrusion mechanism and manipulator to control the operation of the device. Through the present invention, the metal bonding force can be guaranteed The accuracy of the test improves the detection accuracy. At the same time, by using the test jig provided by the present invention, there is no need to cut the wafer, and the wafer with insufficient metal bonding force can be found in time and reworked, avoiding the waste of the wafer.
Description
technical field [0001] The invention relates to the technical field of chip detection, in particular to a test fixture for the bonding force of a metal layer after a chip manufacturing evaporation process. Background technique [0002] Current discrete device chips generally use multi-layer metal as chip electrodes. [0003] The metal layer process on the market generally adopts electron beam evaporation method, sputtering method, electrochemical plating method and CVD method. Electron beam evaporation method; sputtering method; electrochemical plating method; CVD method is generally used for the deposition of metal tungsten for integrated circuits. [0004] In order to take into account the cost and relevant environmental protection regulations, the protection device chip mostly adopts the electron beam evaporation process. Compared with the sputtering process, the gas-phase metal reaches the wafer surface with less energy, and the adhesion of the metal film is relatively...
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IPC IPC(8): G01N19/04H01L21/66
CPCG01N19/04H01L22/12H01L22/20
Inventor 崔文荣
Owner 江苏晟驰微电子有限公司