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Processing method of light emitting diode and related device

A technology of light-emitting diodes and processing methods, which is applied in the direction of assembling printed circuits, electrical components, and circuits with electrical components, and can solve problems such as insufficient precision of processing fixtures, reduced reliability of light-emitting diodes, and irregular processing operations.

Inactive Publication Date: 2021-09-28
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of cutting the copper layer, due to insufficient precision of the processing jig or irregular processing operations, burrs are generated on the cut end of the copper layer, and these burrs will reduce the reliability of the light emitting diode.

Method used

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  • Processing method of light emitting diode and related device
  • Processing method of light emitting diode and related device
  • Processing method of light emitting diode and related device

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Experimental program
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Embodiment Construction

[0047] The following will describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all of them. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0048] Please also refer to figure 1 , figure 1 It is a flow chart of a method for processing a light emitting diode provided in an embodiment of the present application. In this embodiment, the processing method of the light emitting diode 1 includes S100, S200, S300, and S400, and details of S100, S200, S300, and S400 are described below.

[0049] S100: Provide a motherboard 10, the motherboard 10 includes a substrate 11, a plurality of first fixing parts 12, a connecting part 14,...

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Abstract

The invention provides a processing method of a light-emitting diode and a related device. The processing method comprises the following steps: providing a main board, and plating a protective layer on each first fixing part, each connecting part and each second fixing part; removing the connecting part and the protective layer covering the connecting part; and cutting the first surface and the second surface to obtain the light-emitting diodes corresponding to the first fixing parts and the second fixing parts one by one. According to the processing method, after the connecting parts connected between the adjacent first fixing parts are removed, the substrate is cut. Therefore, in the process of cutting the substrate, the connecting part cannot be cut, the problem that burrs are generated on the end face of the connecting part due to cutting of the connecting part in the cutting process is avoided, and the situation that the reliability of the light-emitting diode is affected due to generation of the burrs is avoided.

Description

technical field [0001] The present application relates to the field of semiconductors, in particular to a method for processing light emitting diodes, a method for installing light emitting diodes in electronic equipment, and related devices. Background technique [0002] In the processing technology of the light emitting diode, the substrate will be covered with a plurality of light emitting diode support units. Copper layers are usually connected between LED bracket units to realize electrical connection. The substrate and the copper layer are cut through a dicing process to obtain individual LEDs. However, in the process of cutting the copper layer, due to insufficient precision of the processing jig or irregular processing operations, burrs are generated on the cut end surface of the copper layer, and these burrs will reduce the reliability of the light-emitting diode. Contents of the invention [0003] The present application provides a processing method of a light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H05K3/00H05K3/30
CPCH01L33/48H01L33/62H05K3/301H05K3/0044H01L2933/0033H01L2933/0066
Inventor 杨正官许魁孙平如黄蓓
Owner SHENZHEN JUFEI OPTOELECTRONICS CO LTD