Sensing control Touch technology printed circuit board and preparation method thereof
A printed circuit board and sensor control technology, applied in printed circuit manufacturing, printed circuit, printed circuit secondary processing, etc., can solve the problems of insufficient processing work, reduce the overall quality of the finished circuit board, etc., to improve the quality of the finished product Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0044] refer to figure 1 , a kind of preparation method of sensing control Touch technology printed circuit board, comprises the following steps:
[0045] S1: Pretreatment of the substrate, followed by baking, cutting, computer drilling, desmearing and PTH treatment, of which PTH treatment mainly deals with through-hole in-line components, and backs up drilling data and PTH treatment data Upload to the cloud;
[0046] S2: Process the substrate, sequentially carry out the whole board electroplating, baking, dry film circuit, graphic electroplating, defilm etching, AOI test, solder mask, pressure baking and CNC forming treatment, and process and test the equipment in the previous process The parameters of the final finished product are backed up and uploaded to the cloud, and then fed back to the subsequent equipment after cloud big data analysis and processing to automatically adjust the parameters of the subsequent equipment, so that in the process of processing each circuit ...
Embodiment 2
[0064] Embodiment 2 includes all structures and methods of Embodiment 1, with reference to Figure 2-3 , a method for preparing a printed circuit board with sensor-controlled Touch technology, also includes that the feeding equipment for circuit board baking includes a fixed frame 1, and the top of the fixed frame 1 is provided with a horizontal movement mechanism 7, and the horizontal The bottom of the moving mechanism 7 is connected with a first grasping mechanism 8, the middle position of the bottom of the fixed frame 1 is provided with a lifting mechanism 9, and the top of the lifting mechanism 9 is connected with a second grasping mechanism 10, and the bottom of the fixed frame 1 is provided with a moving mechanism 9. Guide rail 11, the top of one side of the fixed frame 1 is provided with a plate feeding seat 2, and the bottom of the side of the fixed frame 1 away from the plate feeding seat 2 is provided with a connected oven 3, and a heating element is arranged in the o...
Embodiment 3
[0068] Embodiment 3 includes all structures and methods of Embodiment 2, with reference to Figure 2-8 , a method for preparing a sensor-controlled Touch technology printed circuit board, further comprising, the side of the fixing frame 1 away from the oven 3 is connected with a return air duct 12, and the return air duct 12 is located at the top of the limit frame 6 position, the return air duct 12 draws air outwards, the support net plate 16 adopts a double-layer structure, and the middle position of the support net plate 16 is provided with a cavity 1601 with both ends and both sides open, and the top and bottom inner walls of the support net plate 16 Each is provided with a plurality of corresponding installation grooves, balls 1602 with a spherical structure are rollingly connected between two adjacent installation grooves in the vertical direction, and a plurality of grooves 1603 are provided at the positions corresponding to the outer wall of the ball 1602 and the cavity...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More