Method for detecting reliability of board-level BGA (Ball Grid Array) package under fire smoke

Abstract

The invention discloses a method for detecting the reliability of a board-level BGA package under fire smoke. The method comprises the steps: connecting welding spots in the BGA package, and designing the BGA package into different to-be-detected samples through leading out different test points; placing a to-be-tested sample in a composite flue gas corrosion box, placing a multi-channel current testing device outside the composite flue gas corrosion box, and connecting the to-be-tested sample and a wiring terminal on the multi-channel current testing device through a testing lead; starting the multi-channel current testing device, and measuring an initial current value of the to-be-tested sample; opening the composite flue gas corrosion box, providing a composite flue gas environment, and synchronously measuring current values of different to-be-tested samples in the flue gas on line by using a multi-channel current testing device; and analyzing the change trend of the BAG package current value under the fire smoke, obtaining a board-level BGA packagie failure rule, and evaluating the reliability of the board-level BGA package . According to the method, initial defect information related to board-level BGA package can be provided, whether packaging is reliable or not can be conveniently and rapidly judged, and theoretical guidance is provided for understanding and processing of damage influence of post-disaster smoke on a circuit.

Description

technical field [0001] The invention belongs to the field of integrated circuit testing, in particular to a method for detecting reliability of board-level BGA packaging under fire smoke. Background technique [0002] The damage of electronic equipment in fire smoke has caused significant economic losses and social impacts. With the increasing frequency of fire accidents, the reliability detection of electronic equipment has become a problem that must be paid attention to. BGA packaging has the advantages of multiple pins, small size, and high density. It has become a commonly used packaging method for integrated circuit chips. It is responsible for electrical and mechanical connections and is a key factor in determining the reliability of electronic equipment. With the reduction of the spacing and size of BGA interconnection solder joints, the board-level BGA package is more susceptible to failure due to interference from the external environment, and the complex fire and s...

AI Technical Summary

Problems solved by technology

With the reduction of the spacing and size of BGA interconnection solder joints, board-level BGA packaging is more susceptible to failure due to interference from the external environment, and the complex fire and smoke atmosphere is likely to have a huge impact on the reliability of board-level BGA packaging

[0003] At present, most studies on the reliability of board-level BGA packages focus on the failure of the solder joint itself, ignoring the failure of the connection circuit between the solder joints, and the failure mode of the connection circuit between the solder joints is more complicated than the failure of the solder joint itself

Especially in the environment of fire smoke, which contains a lot of smoke particles and corrosive gases, in addition to the interconnection solder joints in the board-level BGA package are easily corroded and cause body damage, smoke particle deposition, tin whisker growth and water vapor, etc. It is also very easy to cause the failure of the connection circuit between solder joints in the board-level BGA package

In traditional detection technology, destructive analysis methods are often used for circuit failure analysis, such as metallographic section, scanning electron microscope and other analysis methods, but this method needs to suspend the reliability test at a certain point in time, and take out the sample for destructive detection and analysis , so as to judge whether the sample is reliable, the reliability of the sample cannot be continuously and real-time non-destructively tested during the test process, resulting in the inability to accurately analyze the reliability evolution law of the board-level BAG package, and the detection process is time-consuming, low in efficiency, and low in accuracy of judgment results

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