Integrated circuit board surface dust-free heat dissipation cooling method

Abstract

The invention relates to the technical field of circuit board heat dissipation, in particular to an integrated circuit board surface dust-free heat dissipation cooling method which comprises the steps that S1, a brushless fan runs at a constant speed, hot air in a heat dissipation box can be extruded to be exhausted outwards under the action of fan blades, cold air can flow into the heat dissipation box again under the action of air pressure, and therefore, the PCB can be cooled continuously. According to the integrated circuit board surface dust-free heat dissipation cooling assembly, the brushless fan runs at a constant speed, cold air can flow through the heat dissipation box, so that the PCB is continuously cooled, different independent flow channels can be formed in the heat dissipation box due to the arrangement of the heat dissipation fins shaped like the Chinese character 'ao', the heat dissipation plate and the heat dissipation cover are clamped on a capacitor and a resistor on the PCB, therefore, the high-temperature elements on the PCB can be subjected to centralized heat dissipation, and the uniform temperature state of the PCB can be kept.

Description

[0001] The surface dust-free cooling method of the integrated circuit board according to the present application is divided by the applicant's application number submitted by the applicant on November 03, 203, CN2020112084450, is divided into the surface of the integrated circuit board. Another technical solution, and therefore, the present application is a score application for the original application No. CN2020112084450 as described in the surface of the integrated circuit board. Technical field [0002] The present invention relates to the field of diffraction of circuit board heat dissipation, in particular to an integrated circuit board surface dust-free cooling method. Background technique [0003] The name of the board is: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB plate, aluminum substrate, high frequency plate, thick copper plate, impedance plate, PCB, ultra-thin circuit board, super Thin circuit board...

AI Technical Summary

Problems solved by technology

[0004] The circuit board will generate a lot of heat during operation. To ensure the normal operation of the circuit board, high-end equipment must be equipped with circuit board heat dissipation components to ensure long-term operation of the equipment. The common heat dissipation methods of the circuit board are nothing more than water cooling and air cooling. As far as the air-cooling method is concerned, the air-cooled heat dissipation is uniform heat dissipation, and the heat generation of different components on the circuit board is different, which will not only cause waste of wind energy, but also cause local overheating of the circuit board, which seriously affects the circuit board. In addition, the wind power of air cooling is relatively slow, which can easily cause dust to fall on the surface of the circuit board, which will seriously cause short circuit damage to the circuit board. The existing equipment lacks a corresponding dust removal structure, and it is difficult to ensure the safe operation of high-end equipment.

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