The invention relates to the technical field of circuit board heat dissipation, in particular to an integrated circuit board surface dust-free heat dissipation and cooling assembly which is characterized by comprising a PCB, a heat dissipation box, an air bellow and an adjuster, the heat dissipation box is fixed to the PCB through screws, the heat dissipation box and the air bellow are fixedly connected into an integrated structure, and the adjuster is further arranged in the air bellow; a plurality of heat dissipation plates are fixedly connected in the heat dissipation box, and are providedwith matching grooves and heat dissipation covers; the front end of the heat dissipation box is provided with a No.1 pressure release hole. According to the integrated circuit board surface dust-freeheat dissipation and cooling assembly, a brushless fan operates at a constant speed, cold air can flow through the heat dissipation box, so that the PCB is cooled uninterruptedly, the plurality of invert-n-shaped heat dissipation plates are arranged, so that independent flow channels can be formed in the heat dissipation box, and the heat dissipation plates and the heat dissipation covers are clamped on capacitors and resistors on the PCB, so that high-temperature elements on the PCB can be subjected to heat dissipation in a centralized manner, and the uniform temperature state of the PCB canbe kept.