Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for processing local dead pixels of superconducting tape in high-temperature superconducting narrow pile line

A technology of high-temperature superconducting tapes and superconducting tapes, applied in the usage of superconducting elements, superconducting/high-conducting conductors, superconducting devices, etc., to achieve the effect of reducing power transmission efficiency and increasing energy loss

Active Publication Date: 2021-10-15
SHANGHAI JIAO TONG UNIV
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the patent applied for in this paper is to retain the original bad part, and adopt the method of making "superconducting interlayer" to alleviate the problem of a sharp drop in critical current caused by bad points.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for processing local dead pixels of superconducting tape in high-temperature superconducting narrow pile line
  • Method for processing local dead pixels of superconducting tape in high-temperature superconducting narrow pile line
  • Method for processing local dead pixels of superconducting tape in high-temperature superconducting narrow pile line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment provides a method for processing local dead spots of superconducting strips in a high-temperature superconducting narrow stack line; figure 1 is a process flow chart, wherein, the local dead spot 3 is located on the second-generation high-temperature superconducting strip 2 to be tested, and the second-generation high-temperature superconducting strip sample is attached to the local bad spot of the second-generation high-temperature superconducting strip 2 to be tested. At point 3, the second-generation high-temperature superconducting strip 2 to be tested is located between the red copper strip 1 and the red copper strip 1, and the second-generation high-temperature superconducting strip 2 to be tested attached to the second-generation high-temperature superconducting strip sample is stacked After encapsulation, a superconducting interlayer 6 is formed.

[0041] The specific method is as follows:

[0042] Prepare narrow stack wire materials: the second...

Embodiment 2

[0047] Prepare narrow stack wire materials: the second-generation high-temperature superconducting tape to be tested 2, the second-generation high-temperature superconducting tape sample, and the copper tape 1.

[0048] S1, measure the critical current of the second-generation high-temperature superconducting strip 2 to be tested, the critical current Ic decays from the original 70A to the area of ​​local dead spots 3 at 10A, and the length of this dead spot area is 10mm; the width is 2mm.

[0049] S2. Face-to-face attachment of superconducting tape: select a second-generation high-temperature superconducting tape sample with a length of 20 mm and a width of 2 mm, and attach the selected second-generation high-temperature superconducting tape sample to the surface by diffusion pressing in a face-to-face manner. The dead point area of ​​the second-generation high-temperature superconducting strip 2 to be tested. The fabrication of the diffusion press joint is the same as in Ex...

Embodiment 3

[0052] Prepare narrow stack wire materials: the second-generation high-temperature superconducting tape to be tested 2, the second-generation high-temperature superconducting tape sample, and the copper tape 1.

[0053] S1. Measure the critical current at each place of the second-generation high-temperature superconducting strip 2 to be tested. The critical current Ic has decayed from the original 70A to the area of ​​local bad spots 3 at 10A. The length of the dead spot area is 18.18mm; the width is 2mm.

[0054] S2. Face-to-face attachment of superconducting tape: select a second-generation high-temperature superconducting tape sample with a length of 20 mm and a width of 2 mm, and attach the selected second-generation high-temperature superconducting tape sample to the surface by diffusion pressing in a face-to-face manner. The dead point area of ​​the second-generation high-temperature superconducting strip 2 to be tested. The fabrication of the diffusion press joint is t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for processing local dead pixels of a superconducting tape in a high-temperature superconducting narrow pile line, and the method comprises the following steps: S1, measuring the critical current of each part of a to-be-measured second-generation high-temperature superconducting tape, and enabling an area where the critical current is reduced to be 80% or less to be a local dead pixel area of the to-be-measured superconducting tape; S2, attaching the superconducting tape face to face: additionally selecting a second-generation high-temperature superconducting tape sample, and attaching the second-generation high-temperature superconducting tape sample to the to-be-tested superconducting tape containing the dead pixel area; and S3, conducting strip stacking and packaging, specifically stacking the to-be-tested second-generation high-temperature superconducting tape to which the second-generation high-temperature superconducting tape sample is attached and a metal strip, and then packaging the to-be-tested second-generation high-temperature superconducting strip and the metal strip into a narrow pile line by using a packaging machine, so as to form a superconducting interlayer by the second-generation high-temperature superconducting tape sample selected in the S2 . According to the method disclosed by the invention, the part, containing the dead pixels, of the superconducting tape is reserved, the superconducting interlayer is introduced, the critical current value of the narrow heaping line is also increased, and the method has higher applicability in a high-current environment.

Description

technical field [0001] The invention belongs to the technical field of superconducting technology, and in particular relates to a method for treating local bad points of superconducting strips in a high-temperature superconducting narrow stack line. Background technique [0002] A plurality of second-generation high-temperature superconducting strips and other metal material strips are packaged into a high-temperature superconducting narrow stack line by stacking, tinning, and other processes. This line has better current-carrying capacity than superconducting thin films. and higher physical strength. But before encapsulating superconducting tapes into narrow stacks, it is necessary to measure their critical currents and identify parts containing dead pixels. The critical current measurement methods of the second-generation high-temperature superconducting strip include electrical measurement and magnetic measurement. In order to obtain the critical current of each region ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/00G01R31/00H01B12/00
CPCG01N27/00G01R31/00H01B12/00Y02E40/60
Inventor 李柱永钱刚盛杰洪智勇金之俭
Owner SHANGHAI JIAO TONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products