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Drying environments for reducing substrate defects

An environmental, dry technology that is used in electrical components, circuits, semiconductor/solid-state device manufacturing, etc. to solve problems such as substrate defects, high air flow, etc.

Pending Publication Date: 2021-10-19
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In many cases, plant interfaces need to operate at higher pressures, resulting in high air flow
High air flow directly onto the substrate as it dries, causing substrate defects

Method used

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  • Drying environments for reducing substrate defects
  • Drying environments for reducing substrate defects
  • Drying environments for reducing substrate defects

Examples

Experimental program
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Embodiment Construction

[0018] In the following description, several specific details are set forth in order to provide a more thorough understanding of the embodiments of the present disclosure. It will be apparent, however, to one skilled in the art that one or more embodiments of the present disclosure may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring one or more embodiments of the present disclosure.

[0019] One or more embodiments described herein relate to a dry environment within a semiconductor processing system. In these embodiments, the substrate exits a factory interface where material is then deposited on the surface of the substrate to form a semiconductor device. After depositing material on the surface of the substrate, the substrate is cleaned and dried in a dry environment before being returned to the factory interface. As discussed above, dry processing and dry environments a...

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PUM

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Abstract

One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.

Description

technical field [0001] One or more embodiments described herein relate generally to semiconductor processing systems, and more specifically, to dry environments within semiconductor processing systems. Background technique [0002] As semiconductor device geometries continue to decrease, the importance of ultra-clean processing increases. Water in a fluid tank (or bath) may be used for cleaning, followed by a rinse bath (eg, in a separate tank or by changing the cleaning tank fluid). After removal from the rinse tank, without the use of drying equipment, the bath liquid may evaporate from the surface of the substrate and cause streaks, spots, and / or leave a post-bath residue on the surface of the substrate. These streaks, spots, and residues can cause subsequent device failure. Accordingly, attention has been directed to improved methods for drying substrates as they are removed from the water bath. [0003] The method known for Marangoni drying creates a surface tension ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67034H01L21/67028H01L21/6719H01L21/67772H01L21/67057H01L21/68764H01L21/67051
Inventor E·维拉兹克兹J·K·阿特金森
Owner APPLIED MATERIALS INC