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Fan-out packaging structure

A technology of packaging structure and plastic packaging compound, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as warping of exposed packaging structures, failure of process and reliability, and impact on flip-chip technology, achieving yield and stability The effect of increasing the speed and increasing the warpage adjustment ability

Pending Publication Date: 2021-10-22
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the reduction of the requirement of thick chip sector of the packaging structure, the exposed packaging structure will have obvious warping, which will affect the subsequent flip-chip process, and there are problems of process and reliability failure.

Method used

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  • Fan-out packaging structure

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0029] It should be noted that terms such as “upper” and “lower” used herein to express relative positions in space are for the purpose of description to describe the relative position of one unit or feature relative to another unit or feature as shown in the drawings. Relationship. The spatially relative terms may be intended to encompass different orientations of the package in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as being "below" other elements or features would then be oriented "above" ...

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PUM

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Abstract

The invention reveals a fan-out packaging structure, and the structure comprises a rewiring layer, a solder ball arranged below the rewiring layer, a high-heat chip and a low-heat chip which are electrically connected above the rewiring layer, and a plastic packaging material which is arranged above the rewiring layer in a filling manner and wraps the high-heat chip and the low-heat chip; the upper surface of the high-heat chip is exposed out of the molding compound, and the upper surface of the low-heat chip is encapsulated in the molding compound; a warping adjustment protection layer is arranged on the upper surface of the low-heat chip; or at least one through hole is formed in the plastic package material right above the low-heat chip, and part of the upper surface of the low-heat chip is exposed out of the plastic package material through the through hole. According to the fan-out packaging structure, the warping adjusting protection layer is arranged on the upper surface of the low-heat chip, or at least one through hole is formed in the plastic packaging material above the low-heat chip, so that the warping adjusting capacity of the whole fan-out packaging structure is improved; and the yield and the stability of the fan-out packaging structure are greatly improved.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a fan-out packaging structure. Background technique [0002] The rewiring-first exposed packaging structure inherently has a thicker rewiring and underfill / plastic bonding layer on the front of the chip, and the bonding layer has a higher thermal expansion coefficient. With the reduction of the requirements for the thickness of the package structure, the exposed package structure will have obvious warpage, which will affect the subsequent flip chip process, and there will be problems of process and reliability failure. Contents of the invention [0003] The object of the present invention is to provide a fan-out packaging structure that solves the above technical problems. [0004] In order to achieve one of the objectives of the above invention, one embodiment of the present invention provides a fan-out packaging structure, including: a redistribution la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/16
CPCH01L23/16H01L23/3171H01L23/562H01L21/568H01L23/49816H01L23/5383H01L23/367H01L23/3135H01L25/0655H01L25/50H01L23/3128H01L21/6835H01L2221/68345H01L21/56H01L24/04H01L24/12H01L24/19H01L2224/04105H01L2224/12105H01L2224/19H01L2924/3511
Inventor 林耀剑
Owner JCET GROUP CO LTD