Packaging structure of remote sensor and packaging method thereof
A technology of packaging structure and packaging method, which is applied in the manufacturing of electric solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of inaccessibility, poor bonding, and short sensing distance of long-distance sensors.
Pending Publication Date: 2021-10-22
LINGSEN PRECISION INDS
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Problems solved by technology
[0004] However, in this way of forming the encapsulant and the cover through the secondary molding process, the bonding between the cover, the encapsulant and the substrate is poor, and the encapsulation is formed by the molding process. The way of the cover, because the molding die cannot be close to each of the lens parts, so the cover can not be close to each of the lens parts, so that the sensing distance of the long-distance sensor is relatively short, therefore, the existing long-distance sensor packaging structure and its package The method still has its shortcomings and needs to be improved
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[0021] Please refer to Figure 1-Figure 2 , shows the package structure 10 of the remote sensor provided by the first preferred embodiment of the present disclosure, which includes a substrate 20 , a light emitting chip 30 , a sensing chip 40 , two packaging materials 50 and a cover 60 .
[0022] In this preferred embodiment, the substrate 20 can be a printed circuit board (commonly called PCB), a bismaleimide triazine substrate (commonly called BT), a glass fiber substrate (commonly called FR4) or a direct copper clad substrate (commonly called DBC). ) but not limited thereto, thus, the production cost of the substrate 20 is relatively low, and the substrate 20 has a carrying surface 22 .
[0023] The light-emitting chip 30 is disposed on the carrying surface 22 and can be electrically connected to the substrate 20 through a wire bonding process. In this preferred embodiment, the light-emitting chip 30 is an LED chip and can be used to emit light.
[0024] The sensing chip 4...
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The invention relates to a packaging structure of a remote sensor and a packaging method thereof. The packaging structure of the remote sensor comprises a substrate, a light-emitting chip, a sensing chip, two packaging colloids and a sealing cover. The substrate is provided with a bearing surface, the light-emitting chip and the sensing chip are arranged on the bearing surface in a mutually separated mode, the two packaging colloids wrap the light-emitting chip and the sensing chip respectively and are separated from each other, the sealing cover is formed in advance, and when the sealing cover is manufactured, the light emitting hole and the light receiving hole are manufactured to be close to the sizes of the lens parts and are fixedly arranged on the bearing surface and the packaging colloids through light-proof viscous colloids. The sealing cover is provided with a light emitting hole and a light receiving hole, the light emitting hole and the light receiving hole are located above the light emitting chip and the sensing chip respectively, and the transverse section of the sealing cover is fixedly arranged on the shoulder portion of the top face of each packaging colloid through the viscous colloid. A gap which is not coated with the viscous colloid is formed between the outer side surface of each packaging colloid and the inner side surface of the extension section of the sealing cover.
Description
[0001] This application is a divisional application, the application number of the parent case: 201611253884.7, the application date: December 30, 2016, and the name: the packaging structure and packaging method of the remote sensor. technical field [0002] The present disclosure is related to the packaging structure, in particular to a packaging structure of a remote sensor and a packaging method thereof. Background technique [0003] In the known packaging structure of remote sensors, a light-emitting chip and a sensing chip are arranged on a substrate, and then the two encapsulation gels are respectively coated on the light-emitting chip and the sensing chip through a molding process (Molding). A hemispherical lens is formed on the top surface of the encapsulant to correspond to the light-emitting chip and the sensing chip. Finally, a cover is placed on the substrate and each of the encapsulant through a molding process to complete the entire packaging process. It is wort...
Claims
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IPC IPC(8): H01L25/16H01L23/31H01L21/50H01L21/56
CPCH01L25/167H01L23/3121H01L21/50H01L21/56H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 林静邑杜明德
Owner LINGSEN PRECISION INDS