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Coating type heating tile floor structure and paving method thereof

A ceramic tile floor and coating technology, which is applied in the direction of building structure, floor, heating method, etc., can solve problems such as hollowing and delamination, poor stability of tile support, easy dislocation and deformation, and achieve the effect of reducing costs

Inactive Publication Date: 2021-10-26
中汇建筑集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional heat-generating floor tile paving method has no reasonable structural measures between the tile surface layer, the heat-generating diaphragm layer, and the insulation layer. It is easy to be misaligned and deformed after long-term use, and the phenomenon of hollowing and delamination occurs, and the low density of the insulation layer causes The support stability between the tile and the tile is poor, and it is easy to collapse during use, so it cannot meet the function

Method used

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  • Coating type heating tile floor structure and paving method thereof
  • Coating type heating tile floor structure and paving method thereof
  • Coating type heating tile floor structure and paving method thereof

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Embodiment Construction

[0020] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

[0021] Such as Figure 1~6 As shown, a film-coated heating tile floor structure includes a thermal insulation module layer and an electric heating coating layer arranged on the upper surface of the thermal insulation layer. The upper surface of the electric heating coating layer is covered with a ceramic tile surface layer. The bottom surface of the thermal insulation module layer is provided with fastening dovetail grooves to facilitate bonding with the ground. The bonding layer 6 fastened to the ground, the polyvinyl chloride foam thermal insulation module layer coated with a heating film and the ceramic tile surface layer 3, the adjacent thermal insulation module layers 4 are all horizontally spliced, and the thermal insulation module Both the upper and low...

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Abstract

The invention relates to a coating type heating tile floor structure and a paving method thereof. The coating type heating tile floor structure comprises a heat preservation and insulation module layer and an electric heating coating layer arranged on the upper surface of the heat preservation and insulation module layer; the upper surface of the electric heating coating layer is covered with a tile surface layer; and fastening dovetail grooves facilitating glue joint with the ground are formed in the bottom face of the heat preservation and insulation module layer and arranged on the bottom side of the heat preservation and insulation module layer at intervals. According to the coating type heating tile floor structure and the paving method thereof, stable connection of paving of the tile surface layer and the heat preservation and insulation module layer can be achieved, and cost can be effectively reduced.

Description

technical field [0001] The invention relates to a ground structure of film-coated heating tiles and a paving method thereof. Background technique [0002] The traditional heat-generating floor tile paving method has no reasonable structural measures between the tile surface layer, the heat-generating diaphragm layer, and the insulation layer. It is easy to be misaligned and deformed after long-term use, and the phenomenon of hollowing and delamination occurs, and the low density of the insulation layer causes The support stability between the tile and the tile is poor, and it is easy to collapse during use, so it cannot meet the function. Contents of the invention [0003] In view of the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a film-coated heating tile floor structure and a paving method thereof, which not only have a reasonable structure, but also have good connection stability. [0004] In order to solve ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/08E04F15/18F24D13/02
CPCE04F15/082E04F15/181F24D13/024E04F2290/023
Inventor 吴承彬吴铮
Owner 中汇建筑集团有限公司