Circuit board structure

A circuit board and heat dissipation structure technology, applied in the directions of printed circuits, printed circuits, circuit thermal devices, etc., can solve problems such as the reliability of circuit boards, and achieve the effect of good heat dissipation capacity

Active Publication Date: 2021-10-26
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Take the configuration of high-power electronic components in the circuit structure as an example. Because high-power electronic components generate a lot of heat during operation, it will cause problems in the reliability of circuit boards

Method used

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  • Circuit board structure
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Embodiment Construction

[0055] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0056] Some embodiments are listed below and described in detail with the accompanying drawings, but the provided embodiments are not intended to limit the scope of the present invention. In addition, the drawings are for illustration purposes only and are not drawn to original scale. In order to facilitate understanding, the same elements in the following description will be described with the same symbols.

[0057] In addition, terms such as "first", "second", etc. used herein do not imply a sequence or order, and it should be understood that they are used to distinguish elements or operations described with the same technical terms.

[0058] Secondly, the words "comprising", "including...

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Abstract

A circuit board structure is provided. The circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has an inner-layer circuit board and a plurality of circuit build-up layers stacked on opposite two surfaces of the inner-layer circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.

Description

technical field [0001] The invention relates to a circuit board, in particular to a circuit board structure with a heat dissipation structure. Background technique [0002] In recent years, in order to increase the application of printed circuit boards (PCBs), there are many technologies that make printed circuit boards into multi-layer circuit structures to increase the internal space for circuit layout. The multilayer circuit board is made by repeatedly stacking and pressing the laminated structure composed of copper foil (copper foil) and prepreg (pp) on the core board (core board) to increase the internal thickness of the circuit board. Wiring space, and use the electroplating process to fill the through hole or blind hole of each stacked structure with conductive material to conduct each layer. In addition, many different types of components, such as chips, connectors, photoelectric components or heat dissipation components, etc., can also be configured in the multilay...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0206H05K1/0204H05K2201/10416H05K3/4046H05K2201/0116
Inventor 吴明豪李少谦
Owner UNIMICRON TECH CORP
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