Wafer cutting blade finished product detection device and detection method thereof

Abstract

The invention discloses a wafer cutting blade finished product detection device, and the device comprises a positioning seat, a fixed rod is fixedly arranged in the middle of one side of the top of the positioning seat, detection equipment is arranged on the outer wall of the fixed rod in a penetrating mode, a sliding groove is formed in one side of the top of the positioning seat, and a supporting frame is arranged at one end of the sliding groove in a sliding mode; a positioning frame is slidably arranged at the top end of the supporting frame, and a first positioning block is fixedly arranged at one end of the top of the supporting frame. The output end of a third motor fixed to the middle position of one side of a fixing frame drives a positioning shaft and a wafer cutting blade to start to rotate, and the output end of a first motor fixed to one side of a positioning frame drives a positioning frame to rotate; so that multiple angles of the wafer cutting blade can be detected conveniently, the wafer cutting blade can be detected more conveniently, damage caused by the fact that a worker needs to adjust the angle is avoided, potential safety hazards of wafer cutting blade detection are reduced, and the working efficiency of the wafer cutting blade detection device is improved.

Description

technical field [0001] The invention relates to the field of wafer dicing blade finished product detection devices, in particular to a wafer dicing blade finished product detection device and a detection method thereof. Background technique [0002] Wafer cutting blades are mainly used for scribing and cutting metal materials, silicon, germanium, gallium arsenide and other semiconductor substrate materials, and can process solar panels, silicon wafers, ceramic sheets, aluminum foil, etc. The edge is smooth, which can greatly improve the processing efficiency and optimize the processing effect. The finished product inspection device is used to detect the appearance and pass rate of the wafer cutting blade. [0003] In the prior art, the wafer dicing blade finished product detection device is usually used to detect the use of the wafer dicing blade. The commonly used detection device requires the staff to fiddle with the position and angle of the wafer dicing blade. Since the ...

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Problems solved by technology

[0003] In the prior art, the wafer dicing blade finished product detection device is usually used to detect the use of the wafer dicing blade. The commonly used detection device requires the staff to fiddle with the position and angle of the wafer dicing blade. Since the outer wall of the wafer dicing blade is sharp, When detecting the wafer dicing blade, it is easy to cause safety hazards such as scratches, which makes the detection easy to cause problems such as infection, and reduces the detection efficiency of the wafer dicing blade. Therefore, a wafer dicing blade finished product detection device and its detection method are needed.

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