An optical chip testing device

Abstract

The invention relates to the field of chip testing, in particular to an optical chip testing device, comprising a base, the base is an L-shaped structure, a rotating shaft is installed on the side wall of the base, and a fixing frame is fixedly installed on the end of the rotating shaft away from the base, and a There is an insertion slot that runs through the fixed frame, and a positioning frame is inserted in the insertion slot. A plurality of positioning slots are evenly distributed in a straight line on the positioning frame. Slide slots are provided on the inner walls of both sides of the positioning slot. A number of chips are inserted, and the inner wall of the chute is distributed in a straight line and evenly provided with a plurality of grooves. Spring pressing rods are arranged in the grooves, and pressing blocks are arranged at one end of the spring pressing rods, and the pressing blocks are far away from the spring pressing rods. One side of each side is an arc-shaped structure, and the end of the spring pressure rod away from the pressure block is provided with an inclined surface, and a plurality of spring insertion rods are evenly inserted on the positioning frame and located on both sides of the positioning groove. The invention can quickly clamp and position multiple optical chips at the same time.

Description

technical field [0001] The invention relates to the field of chip testing, in particular to an optical chip testing device. Background technique [0002] Optical chips are also called semiconductor laser chips. Semiconductor laser chips are used as the main components of semiconductor lasers. They are a kind of light-stimulated radiation generated by the carrier recombination of direct bandgap semiconductors to emit light and generate laser light after gain. main original. That is to say, a semiconductor laser chip is essentially a semiconductor chip. The function of this chip is to generate laser light, so it is called a semiconductor laser chip. [0003] Most of the existing optical chips need to be ground and polished during production, and improper operation often results in inadequate or excessive grinding of the chips during the grinding process, which directly affects the production quality of optical chips. Therefore, After the optical chip is produced, processed a...

AI Technical Summary

Problems solved by technology

[0003] Most of the existing optical chips need to be ground and polished during production, and improper operation often results in inadequate or excessive grinding of the chips during the grinding process, which directly affects the production quality of optical chips. Therefore, After the optical chip is produced and processed, it is usually necessary to test the performance of the optical chip

When inspecting an optical chip, it is necessary to fix the optical chip first, but at present, most inspection devices can only clamp and detect a single chip, the detection efficiency is low, and it is easy to use during the clamping process. Fingers come into contact with the optical chip, which affects the detection effect of the optical chip. At the same time, when it is necessary to detect both sides of the optical chip, it is usually necessary to manually flip the optical chip and clamp it again, which further reduces the optical quality. The detection efficiency of the chip brings inconvenience to the test of the optical chip

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