Wafer scribing device for machining and using method thereof

Abstract

The invention discloses a wafer scribing device for machining and a using method thereof. The wafer scribing device comprises a base, wherein an adjusting mechanism is arranged in the center of the top of the base, a control panel is connected to one side of the front end of the top of the base through screws, the adjusting mechanism comprises a longitudinal linear sliding rail pair, a transverse linear sliding rail pair and a placement disc, and the transverse linear sliding rail pair is arranged at the top of the longitudinal linear sliding rail pair. Through transverse movement of the longitudinal linear sliding rail pair, longitudinal movement of the transverse linear sliding rail pair and cooperation with the alignment equipment body, the wafer alignment function is achieved, initial placement of wafers is facilitated through arrangement of annular scales and receding holes, and then alignment work of the wafers is facilitated; and the wafer can be fixed and driven to rotate through a clamping assembly, and a scribing assembly which moves up and down synchronously is matched to rapidly complete scribing of the two sides of the wafer, so that the scribing efficiency is improved, and it can be guaranteed that the scribing depths of the front and the back are the same.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to a wafer dicing device for mechanical processing and a method for using the same. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer and become an IC with specific electrical functions. Products, the raw material of the wafer is silicon, and the surface of the earth's crust is inexhaustible silica, the silica ore is refined by an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon, wafer In the process of processing, it needs to be diced. At present, the existing wafer dicing equipment has the following shortcomings: 1. The initial placement of the wafer is relatively random, which affects the alignme...

AI Technical Summary

Problems solved by technology

[0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer and become an IC with specific electrical functions. Products, the raw material of the wafer is silicon, and the surface of the earth's crust is inexhaustible silica, the silica ore is refined by an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon, wafer In the process of processing, it needs to be diced. At present, the existing wafer dicing equipment has the following shortcomings: 1. The initial placement of the wafer is relatively random, which affects the alignment of the subsequent wafers; 2. Every Only one surface of the wafer can be diced at a time, which makes it difficult to control the depth of scribing on the front and back sides, and increases the work of post-polishing

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