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Wafer laser engraving machine and using method thereof

A laser engraving machine and wafer technology, applied in the field of engraving machines, can solve the problems of inability to realize mechanical automatic double-sided engraving, difficulty in ensuring flatness, and reducing processing accuracy, so as to improve processing efficiency and finished product quality, and achieve a large engraving range. Guaranteed accuracy

Pending Publication Date: 2021-11-02
苏州威百斯特智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The laser engraving machine in the above patent cannot realize mechanical automatic double-sided engraving during engraving, and is suitable for the transmission requirements of a single-sided engraving machine. The circle is easy to break, and it is difficult to ensure its flatness by manual operation during the engraving process, which reduces the processing accuracy

Method used

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  • Wafer laser engraving machine and using method thereof
  • Wafer laser engraving machine and using method thereof
  • Wafer laser engraving machine and using method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] as attached Figure 1-2 As shown, a wafer laser engraving machine includes a chassis 1, a laser device 2, a control device and a casing 3; a support frame 101 and a support plate 102 are arranged above the chassis 1;

[0064] The control device is arranged in the casing 1 and on the casing 3, the casing 3 is arranged above the casing 1, and the laser device 2 is arranged inside the casing 3;

[0065] The laser device 2 includes a loading and unloading device 4, a handling and turning device 5, an identification device 6, an engraving device 7 and a first transmission device 8;

[0066] The loading and unloading device 4, the identification device 6, and the engraving device 7 are arranged on the support frame 101, and the transfer and turning device 5 is arranged on the support plate 102;

[0067] The first conveying device 8 is arranged below the loading and unloading device 4 , the identifying device 6 and the engraving device 7 .

[0068] Further, the chassis 1 is ...

Embodiment 2

[0086] This embodiment is carried out on the basis of the above-mentioned embodiment 1, and mainly introduces an engraving device.

[0087] as attached Figure 7 As shown, the engraving device 7 includes a bracket 701, the bracket 701 is provided with a support platform 702, the support platform 702 is provided with a laser 703, and the bracket 701 is sequentially provided with a beam expander 705 and a vibrating mirror 704 A field lens is further arranged under the vibrating mirror 704, so as to realize the propagation of the laser light path.

[0088] The field mirror is fixed below the vibrating mirror 704, and is fixed on the vibrating mirror 704 through the field mirror segment ring, and a diffuse aperture is formed in the field mirror, which can expand the engraving range and improve the definition of the edge of the engraving pattern .

Embodiment 3

[0090] This embodiment is carried out on the basis of the above-mentioned embodiment 1, and mainly introduces a turning device and a wafer tray.

[0091] A turning device 520 includes a rotating device and a shift fork 521 , the rotating device includes a rotating cylinder 522 and a rotating joint 523 , and the rotating joint 523 is fixedly connected to the shifting fork 521 .

[0092] Further, the shift fork 521 includes a flange and a suction cup, the suction cup is located at one end close to the rotating shaft 523, and the flange is at the other end.

[0093] Further, the suction cup has a polygonal structure, and a gap is opened inside the suction cup.

[0094] A wafer tray 805 includes a motor, a rotating shaft and a tray. A suction cup is connected to the rotating shaft, and the suction cup is connected to the tray by bolts.

[0095] Further, the suction cup is provided with continuous and uniform small holes.

[0096]Further, the flipping device and the wafer tray ar...

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Abstract

The invention relates to a wafer laser engraving machine and a using method thereof. The engraving machine comprises a case, a laser device, a control device and a shell. A supporting frame and a supporting plate are arranged above the case. The control device is arranged in the case and on the shell, the shell is arranged above the case, and the laser device is arranged in the shell. The laser device comprises a feeding and discharging device, a carrying and overturning device, a recognition device, an engraving device and a first conveying device. According to the wafer laser engraving machine and the using method thereof, an engraving plate can be subjected to mechanical plate turning operation, the double-face engraving requirement is met, operation is easy, use is convenient, manual plate turning is not needed, and the labor cost is reduced; a shifting fork and a wafer tray both adopt vacuum adsorption to operate a wafer, so that the wafer is not likely to break, and the production efficiency and the product quality are effectively improved; and flexible movement of the carrying and overturning device is achieved, and the application range is wider.

Description

technical field [0001] The invention relates to the technical field of engraving machines, in particular to a wafer laser engraving machine and a method for using the same. Background technique [0002] One of the great inventions of this century, the laser has enormous technological potential. Laser is known as "universal processing tool", which provides a production technology with significant economic benefits and high production efficiency for the material processing industry. [0003] With the development of laser technology, laser engraving has become a new industrial processing technology. Laser engraving machine is a mechanical and electrical integration equipment that comprehensively applies laser, electronics, computer and other technologies. It is widely used in military industry, electromechanical, automobile, advertising, Art, souvenir processing and many other fields are widely used in the market, and the market demand is very large. [0004] The principle o...

Claims

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Application Information

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IPC IPC(8): B23K26/362B23K26/70
Inventor 郭飞徐胜江林杰
Owner 苏州威百斯特智能科技有限公司