Micro component picking and placing device and method controlled by liquid medium
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A liquid medium, pick-and-place device technology, applied in the direction of transportation and packaging, conveyor objects, etc., can solve problems such as difficulty in ensuring release accuracy
Active Publication Date: 2021-11-02
SHANDONG UNIV OF TECH
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Problems solved by technology
The existing capillary force manipulation methods based on liquid media are often suitable for the pick-up or release of micro-components, and it is difficult to guarantee the release accuracy
Method used
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specific Embodiment approach 1
[0018] Specific implementation mode one: combine figure 1 , figure 2 , image 3 and Figure 4 Illustrates that a micro-component pick-and-place device controlled by a liquid medium in this embodiment includes a displacement control module, an inertia release module, a temperature control module, and an end effector module. The displacement control module includes a mounting frame 1-1, a micro-drive Motor 1-2, coupling 1-3, ball screw 1-4, screw nut 1-5, long connecting plate 1-6, inertia release module including connecting piece 1-7, electromagnet 1-8, suction Iron head 1-9, spring 1-10, spring holder 1-11, temperature control module includes heat conduction plate 1-12, two fixing bolts 1-13, four-hole connector 1-16, two fixing baffles 1 -17, electric heater 1-18, cooling plate 1-19, water cooling head 1-20, hose 1-21, end effector module including gasket A 2-1, gasket B 2-2, attitude adjustment plate 2-3 , probe 2-4, elastic film 2-5, the mounting frame 1-1 and the micr...
specific Embodiment approach 2
[0019] Specific implementation mode two: combination figure 1 , figure 2 , image 3 and Figure 4 It is explained that the long connecting plate 1-6 and the ball screw 1-4 in this embodiment are respectively in clearance fit with the mounting frame 1-1. Such arrangement can ensure the smooth movement of the long connecting plate up and down without frictional hindrance, and is conducive to the radial fixation of the ball screw. The other components and connections are the same as those in Embodiment 1.
specific Embodiment approach 3
[0020] Specific implementation mode three: combination figure 1 , figure 2 , image 3 and Figure 4 Description, the connector 1-7, the electromagnet 1-8, the iron head 1-9, the spring 1-10, the inner hole of the spring holder 1-11, the inner hole of the heat conducting plate 1-12 and the Probe 2-4 coaxial setup. Such an arrangement is convenient for assembly and unobstructed up and down movement of the probes 2-4, and other components and connections are the same as those in the first or second embodiment.
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Abstract
The invention discloses a micro component picking and placing device and method controlled by a liquid medium, and relates to micro component operation in the fields of microelectronics, micro assembly and the like. The micro component picking and placing device controlled by liquid medium comprises a mounting frame, a micro driving motor, a coupler, a ball screw, a screw nut, a long connecting plate, a connecting piece, an electromagnet, an iron attracting head, a spring, a spring fixing seat, a heat conducting plate, two fixing bolts, a four-hole connecting piece, two fixing baffles, an electric heating piece, a refrigerating piece, a water cooling head, a hose, a gasket A, a gasket B, a posture adjusting plate, a probe, an elastic film, a long connecting plate and a ball screw in clearance fit with the mounting frame, and the connecting piece, the electromagnet, the magnet head, the spring, an inner hole of the spring fixing base, an inner hole of the heat conducting plate and the probe are coaxially arranged. The electromagnet and the magnet head are arranged in a spaced mode, a magnetic force is generated under excitation of an external current field, the electromagnet is connected with the magnet head in an adsorption mode, and after the external current field disappears, the electromagnet and the magnet head are disconnected instantly. The device is used for flexibly picking a micro member, adjusting a posture of the micro member and performing a release operation.
Description
technical field [0001] The invention relates to the field of pick-up and release operations of micro-components, in particular to a pick-and-place device and method for micro-components controlled by a liquid medium. Background technique [0002] With the rapid development of many fields such as micro-electromechanical, biology, chemistry, and medical treatment, the operation requirements of the involved micro-components (feature size at the millimeter level, sub-millimeter level or even micron level) are becoming more and more extensive, and the corresponding manipulation of micro-components There are more and more methods. At present, the manipulation methods of micro-components mainly include mechanical clamping method, vacuum adsorption method and adhesion control method. The mechanical clamping method uses two-finger, three-finger or multi-finger devices to directly contact and clamp micro-components, and generate static friction with the micro-components to overcome g...
Claims
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Application Information
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