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Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of a large amount of time and poor manufacturing efficiency, and achieve the effects of good efficiency, excellent electrical insulation reliability, and excellent crack resistance

Pending Publication Date: 2021-11-02
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further, when forming via holes by a laser processing machine, each via hole needs to be formed one by one, and when a plurality of via holes need to be provided due to high density, it takes a lot of time to form the via holes, thereby causing poor manufacturing efficiency. question

Method used

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  • Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board
  • Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board
  • Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board

Examples

Experimental program
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Effect test

Embodiment

[0345] Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples.

[0346] In addition, the photosensitive resin composition obtained from Examples 1-3 and Comparative Examples 1-2 evaluated the characteristic by the method shown below.

[0347] [1. Evaluation of through-hole resolution]

[0348] (1-1) Production of laminated body for evaluation

[0349] A substrate for a printed wiring board (manufactured by Hitachi Chemical Co., Ltd., manufactured by Hitachi Chemical Co., Ltd., manufactured by laminating copper foil with a thickness of 12 μm on a glass epoxy substrate) was treated with a roughening pretreatment solution (manufactured by MEC Corporation, trade name "CZ-8100"). The surface of the copper foil with the trade name "MCL-E-679") was treated, washed with water, and dried to obtain a substrate for a printed wiring board subjected to a pre-roughening treatment. Next, the protective film was peeled and rem...

Synthetic example 1

[0376] Synthesis of acid-modified epoxy derivative 1 [(A1-1) component] containing ethylenically unsaturated group and alicyclic skeleton

[0377] Add 350 parts by mass of dicyclopentadiene type epoxy resin ("XD-1000" produced by Nippon Kayaku Co., Ltd., epoxy equivalent 252g / eq, softening point 74.2 ° C, equivalent to (a1) composition, by the above general formula (a1-1) represents. The number of ring-forming carbon atoms of the alicyclic skeleton: 10), 70 parts by mass of acrylic acid (corresponding to component (a2)), 0.5 parts by mass of methylhydroquinone, and 120 parts by mass of carbitol acetic acid The ester was reacted by heating to 90°C with stirring to dissolve the mixture.

[0378] Next, the obtained solution was cooled to 60 degreeC, 2 mass parts of triphenylphosphine were added, it heated at 100 degreeC, and it reacted until the acid value of a solution became 1 mgKOH / g. 98 mass parts of tetrahydrophthalic anhydrides (corresponding to (a3) ​​component) and 85 m...

Synthetic example 2

[0380] Synthesis of acid-modified epoxy derivative 2 [(A1-1) component] containing ethylenically unsaturated group and alicyclic skeleton

[0381] Add 350 parts by mass of dicyclopentadiene type epoxy resin ("EPICLON (registered trademark) HP-7200" produced by DIC Corporation, epoxy equivalent 254~264g / eq, softening point 56~66 ℃, equivalent to (a1 ) component, represented by the above general formula (a1-1). The number of ring-forming carbon atoms in the alicyclic skeleton: 10), 70 parts by mass of acrylic acid (equivalent to the component (a2)), 0.5 parts by mass of methylhydroquinone, 120 parts by mass Parts by mass of carbitol acetate were reacted by heating to 90° C. and stirring, thereby dissolving the mixture.

[0382] Next, the obtained solution was cooled to 60 degreeC, 2 mass parts of triphenylphosphine were added, it heated at 100 degreeC, and it reacted until the acid value of a solution became 1 mgKOH / g. 98 mass parts of tetrahydrophthalic anhydrides (correspond...

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Abstract

Provided are: a photosensitive resin composition that has excellent via resolution, adhesive strength to plated copper, crack resistance, and electrical insulation reliability; a photosensitive resin composition for forming photo vias; and a photosensitive resin composition for interlayer insulating layers. Also provided are a photosensitive resin film comprising a photosensitive resin composition and a photosensitive resin film for interlayer insulation layers. In addition, a multilayer printed wiring board and a semiconductor package are provided, as well as a production method for the multilayer printed wiring board. Specifically, the photosensitive resin composition contains a photopolymerizable compound (A) having an ethylenically unsaturated group and a photopolymerization initiator. The photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound that has an ethylenically unsaturated group (A1), an acidic substituent, and an alicyclic skeleton.

Description

technical field [0001] This indication relates to the manufacturing method of a photosensitive resin composition, a photosensitive resin film, a multilayer printed wiring board, a semiconductor package, and a multilayer printed wiring board. Background technique [0002] In recent years, the miniaturization and high performance of electronic equipment have been promoted, and the density of multilayer printed wiring boards has been increased by increasing the number of circuit layers and miniaturizing wiring. In particular, the density of semiconductor packaging substrates such as BGA (ball grid array) and CSP (chip size package) on which semiconductor chips are mounted is significantly higher, and in addition to miniaturization of wiring, insulation films are also required Thin film and further reduction in diameter of via holes (also referred to as "via holes") for interlayer connection. In addition, with the thinning of insulating films in printed wiring boards, excellent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/027G03F7/038G03F7/0385G03F7/32C08L63/10C08G59/68C08G59/1466C08K3/36C08L63/00G03F7/004G03F7/028G03F7/032C08F290/14C08F2/50C08F2/44H01L23/14H05K3/28H05K3/46C08F212/08G03F7/0045G03F7/11
Inventor 冈出翔太野本周司铃木庆一
Owner RESONAC CORPORATION
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