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Baking device and baking method

A technology of baking device and baking method, which is applied to the device for coating liquid on the surface, pretreatment surface, coating, etc., can solve problems such as wafer warpage, achieve warpage avoidance, uniform heating, and improve The effect of curing efficiency

Active Publication Date: 2021-11-09
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005]Therefore, the technical problem to be solved by the present invention is to overcome the defect that the existing baking method is easy to cause the wafer to warp, thereby providing a baking device and a baking roasting method

Method used

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  • Baking device and baking method

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Embodiment 1

[0037] see figure 1 , the present embodiment provides a baking device, comprising: a heating component 1, the heating component 1 includes a plurality of first through holes; a lifting assembly 2, the lifting assembly 2 includes a plurality of lifting pins 21, and the lifting pins 21 Suitable for passing through the first through hole, the lifting pin 21 is suitable for carrying the carrier board 6 ; a stepwise driving assembly, the stepwise driving component is suitable for at least driving the lifting pin 21 to descend stepwise.

[0038] The aforementioned baking device drives the lifting pins 21 down stepwise through a stepwise driving assembly, so that the distance between the carrier plate 6 on the lifting pins 21 and the heating component 1 is reduced stepwise. On the one hand, there is a certain distance between the carrier plate 6 and the heating element 1 before the lift pins 21 descend stepwise, so that the carrier plate 6 The heating temperature of the heating elem...

Embodiment 2

[0056] This embodiment provides a baking method, including: providing a carrier plate 6 and the baking device, the structure of the baking device is as follows figure 1 As shown; the staged drive assembly drives the lifting pin 21 to pass through the first through hole and rise to the initial position; after the lifting pin 21 rises to the initial position, the carrier plate 6 is placed on the lifting pin 21; after the carrier board 6 is placed on the lift pin 21, the step-by-step drive assembly drives the lift pin 21 to perform a step-by-step descent, and the step-by-step descent includes the first down to the Nth time Descending, N is an integer greater than or equal to 2; after the carrier board 6 is placed on the lift pin 21 and before the lift pin 21 descends in stages, after the kth drop and before the k+1th drop , and after the lifting pin 21 descends N times, the heating component 1 bakes the carrier plate 6 .

[0057] In the above baking method, after the lifting pin...

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Abstract

The invention provides a baking device and a baking method. The baking device comprises a heating part which comprises a plurality of first through holes; a lifting assembly which comprises a plurality of lifting pins, wherein the lifting pins are suitable for penetrating through the first through holes, and the lifting pins are suitable for bearing a carrier plate; and a stage driving assembly suitable for at least driving the lifting pins to descend stage by stage. According to the baking device, the probability of warping of a wafer is reduced, and meanwhile the curing efficiency of an adhesive film is relatively high.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a baking device and a baking method. Background technique [0002] With the development of semiconductor technology, the requirements for the integration and function of various components are getting higher and higher, and the direction of research and development is gradually shifting to how to achieve higher density packages. The main principle of high-density packaging is to increase the integration of chips or corresponding electronic devices by stacking wafers and wafers or chips layer by layer. [0003] During the manufacturing process of the semiconductor device, the steps of coating the adhesive film on the surface of the wafer and baking the adhesive film are involved. During the baking process, the solvent in the film gradually volatilizes, and the film is cured. When the adhesive film on the wafer surface is heated unevenly during the baking proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D3/02B05D3/04
CPCB05D3/0254B05D3/0486Y02P70/50
Inventor 陈文斌肖克张健
Owner NAT CENT FOR ADVANCED PACKAGING
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