display panel

A display panel and substrate technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as metal wiring short circuit, achieve the effects of extending the flow path, increasing the flow space, and reducing the thickness of the photoresist

Active Publication Date: 2022-07-29
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a display panel to solve the technical problem of short circuit between metal traces at the junction of high and low terrain existing in the prior art

Method used

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Embodiment Construction

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, but not to limit the present application. In this application, unless otherwise stated, the directional words used such as "upper" and "lower" generally refer to the upper and lower sides of the device in actual use or working state, specifically the drawing direction in the accompanying drawings ; while "inside...

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Abstract

The present application discloses a display panel. The display panel includes a substrate, an insulating layer, a first signal wiring and a second signal wiring. The substrate has a first area and a second area arranged adjacently; the insulating layer is arranged on the substrate, and located in the first area, the insulating layer and the part of the substrate corresponding to the second area form a stepped structure, the insulating layer includes a first surface, and the first surface is located at the junction of the first area and the second area; the first signal traces are arranged on On the stepped structure, and the orthographic projection of the plane on which the substrate is located intersects with the orthographic projection of the first surface on the plane where the substrate is located; the second signal wiring is arranged on the stepped structure, and is arranged at intervals from the first signal wiring, and the second signal wiring is arranged on the stepped structure. The orthographic projection of the line on the plane of the substrate intersects with the orthographic projection of the first surface on the plane of the substrate; the first surface includes a concave-convex surface, and the concave-convex surface is located between the first signal line and the second signal line. The present application reduces the probability of short circuit between metal traces at the junction of high and low terrain.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, to a display panel. Background technique [0002] In the display panel, an insulating layer is usually installed to insulate the metal traces of each layer. However, due to the different requirements for the insulating layer in different areas of the panel, there will be some areas in the display panel that do not need an insulating layer. There is a difference in terrain between the area with the insulating layer and the area without the insulating layer. [0003] Usually, at the junction of the high-landscape area provided with the insulating layer and the low-landscape area not provided with the insulating layer, there will be some metal traces spanning the junction of the high and low topography. However, in the patterning process of metal traces such as photolithography process, due to the influence of terrain difference, photoresist accumulation will occur at ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12
CPCH01L27/1244
Inventor 刘建欣
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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