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High-thickness-diameter-ratio copper plating and hole filling method and core board

A high aspect ratio, copper plating technology, applied in the direction of electrical connection of printed components, printed circuit components, printed circuits, etc., can solve the problem of inability to guarantee product production quality, difficult to maintain smooth surface layer, and inability to control the flow of electricity well. Hole type and other problems, to achieve the effect of facilitating electroplating copper plating operation, maintaining smoothness, and ensuring the pass rate

Pending Publication Date: 2021-11-09
广东世运电路科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the manufacturing process of circuit boards, there is a step of electroplating and hole filling. Usually, copper plating and hole filling are performed by electroplating hole filling potion. However, when the thickness-to-diameter ratio of the through hole exceeds 3:1, the current method is not good enough. It is difficult to control the hole pattern of the through hole, the surface layer is difficult to keep smooth, and the production quality of the product cannot be guaranteed

Method used

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  • High-thickness-diameter-ratio copper plating and hole filling method and core board

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Embodiment Construction

[0036] Embodiments of the present invention will be described in detail below, and examples of the embodiments are illustrated in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The following is exemplary, and is intended to be illustrative of the invention, not to be construed as limiting the invention.

[0037] In the description of the present invention, it is to be understood that the orientation or positional relationship of the orientation, such as upper, lower, prior,,, left, right, etc., based on the orientation or positional relationship shown in the drawings, is only To facilitate the description of the present new type and simplified description, not indicating or implying that the device or element must have a specific orientation, constructing and operating in a particular orientation, and is therefore uninusable to limit the invention.

[0038] In the description of...

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Abstract

The invention discloses a high-thickness-diameter-ratio copper plating and hole filling method and a core board. A separable first copper foil layer is placed on a supporting plate, a first copper column is electroplated on the first copper foil layer, an insulating layer covers the first copper column, a first blind hole is drilled in the position, which corresponds to the first copper column, of the insulating layer, metallization operation is carried out on the first blind hole, and electroplating hole filling treatment is carried out on the whole production board. According to the method, the surface of the through hole can be kept smooth, and the production quality of a product can be guaranteed.

Description

Technical field [0001] The present invention relates to the fabrication of printed circuit boards, particularly a method of high thickness and copper-plated filling, and a core plate. Background technique [0002] One step in the manufacturing process flow is plated in the manufacturing process, typically, copper-plated binding holes by electroplating bleid water, however, when the thickness diameter of the through hole is more than 3: 1, the current method is no longer good. The hole type of the control through hole is difficult to maintain smooth, and the product quality is not guaranteed. Inventive content [0003] In order to overcome the shortcomings of the prior art, it is an object of the present invention to provide a method of high thickness and a copper-plated binder and a core plate, which can keep the surface of the through hole to ensure the quality of the product. [0004] The technical solution used in solving its problem is: [0005] In the first aspect, the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K1/11
CPCH05K3/42H05K3/423H05K1/11
Inventor 蔡琨辰
Owner 广东世运电路科技股份有限公司
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