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Curable silicone composition, cured product of same and method for producing same

A silicone and composition technology, which is applied in the field of curable silicone compositions, can solve the problems of toughness, softness damage, and reduction of linear expansion coefficient of the solidified product of the melting characteristics of the composition, so as to achieve excellent curing characteristics, efficient manufacturing, Excellent operability

Active Publication Date: 2021-11-09
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when a large amount of functional inorganic filler is mixed with these compositions, there is a problem that the melting characteristics (=hot-melt property) of the composition and the toughness and flexibility of the cured product are significantly impaired.
Therefore, for example, it is difficult to add a large amount of thermally conductive inorganic filler such as alumina to achieve high thermal conductivity, or to add a large amount of dimensionally stable inorganic filler such as silica to greatly reduce the coefficient of linear expansion.

Method used

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  • Curable silicone composition, cured product of same and method for producing same
  • Curable silicone composition, cured product of same and method for producing same
  • Curable silicone composition, cured product of same and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0289] The hot-melt curable silicone composition of the present invention and its production method will be described in detail using examples and comparative examples. In addition, in the formula, Me and Vi represent a methyl group and a vinyl group, respectively. In addition, about the curable silicone composition of each Example and a comparative example, the softening point was measured by the following method. In addition, the curable silicone composition was heated at 150° C. for 2 hours to produce a cured product, and the elastic modulus and tensile elongation were measured by the following methods. The results are shown in Table 1.

[0290] [melt viscosity]

[0291] In terms of the melt viscosity of the curable silicone composition at 150° C., a Koka flow tester CFT-500EX (manufactured by Shimadzu Corporation) was used under a pressure of 100 kgf using a nozzle with a diameter of 0.5 mm. measured.

[0292] [Storage modulus]

[0293] The curable silicone compositio...

reference example 1

[0302] Put into a 1L flask the average unit formula which is a white solid at 25°C

[0303] (Me 3 SiO 1 / 2 ) 0.44 (SiO 4 / 2 ) 0.56 (HO 1 / 2 ) 0.02

[0304] 55% by mass of the indicated polyorganosiloxane resin-xylene solution 270.5 g and 1,3-divinyltetramethyldisiloxane complex of platinum 1,3-divinyltetramethyl 0.375 g of a disiloxane solution (content of platinum metal = about 4000 ppm) was uniformly stirred at room temperature (25° C.) to prepare a disiloxane resin (1) containing 10 ppm by mass of platinum metal. Toluene solution. In addition, this organopolysiloxane resin (1) does not soften or melt even when heated to 200° C., and does not have thermal fusibility. In addition, the weight-average molecular weight measured by GPC in a toluene solvent was 18500 Da.

reference example 2

[0306] Put into a 1L flask the average unit formula which is a white solid at 25°C

[0307] (Me 3 SiO 1 / 2 ) 0.46 (SiO 4 / 2 ) 0.54 (HO 1 / 2 ) 0.02

[0308] 55% by mass of the indicated polyorganosiloxane resin-xylene solution 270.5 g and 1,3-divinyltetramethyldisiloxane complex of platinum 1,3-divinyltetramethyl 0.375 g of a disiloxane solution (content of platinum metal = about 4000 ppm) was uniformly stirred at room temperature (25° C.) to prepare a disiloxane resin (2) containing 10 ppm by mass of platinum metal. Toluene solution. In addition, this polyorganosiloxane resin (2) does not soften or melt even when heated to 200° C., and does not have thermal fusibility. In addition, the weight-average molecular weight measured by GPC in a toluene solvent was 11000 Da.

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Abstract

To provide: a curable silicone composition which has excellent hot melt properties and excellent moldability, and which enables the achievement of a cured product that is not deteriorated in terms of flexibility, toughness and stress relaxation characteristics even if a large amount of a functional inorganic filler is blended therein; and the like. A curable silicone composition which contains one or more kinds of functional fillers and an organopolysiloxane resin that has a weight average molecular weight within the range of 2,000-15,000, while containing a siloxane unit represented by SiO4 / 2 in an amount of at least 20% by mole or more of the all siloxane units, and which is configured such that: the content of a vinyl group moiety (CH2=CH-) in a curing reactive functional group containing a carbon-carbon double bond per 100 g of the silicone component in the composition is 0.05-1.50% by mole; and the composition as a whole has hot melt properties. In addition, applications of this curable silicone composition.

Description

technical field [0001] The present invention relates to a compound that can be obtained by a simple production method, has excellent heat-meltability and formability, and does not impair the flexibility, toughness and stress relaxation properties of the obtained cured product even if a large amount of functional inorganic filler is blended. Curable silicone composition, its molded product (granule, sheet, etc.) and its cured product. In addition, the present invention relates to a cured product of the composition and uses thereof (particularly including members for semiconductors and semiconductors having the cured product), a method for producing the composition, a method for molding the cured product, and the like. Background technique [0002] Curable silicone compositions are used in a wide range of industrial fields because they cure to form cured products having excellent heat resistance, cold resistance, electrical insulation, weather resistance, water resistance, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07B32B27/00C08K3/013C08K5/14C08L83/04C08L83/05C09J7/35C09J183/07H01L23/29H01L23/31
CPCC08L83/04C08J3/243C08J2383/07B29C55/02H01L23/296C08G77/12C08G77/20C08K2003/2227C08L83/00C08K5/56C08K3/22C08K5/54C08K5/14C08K3/013C08J5/18C09J7/10B32B7/06B32B7/12C08L2205/025C09J7/35B29C45/0001B29K2083/00B32B2457/14C08L2203/20C08L2205/035C09J5/06C09J11/04C09J183/04C09J2203/326C09J2483/00H01L23/29
Inventor 山崎亮介尾崎弘一今泉彻
Owner DOW TORAY CO LTD