Curable silicone composition, cured product of same and method for producing same
A silicone and composition technology, which is applied in the field of curable silicone compositions, can solve the problems of toughness, softness damage, and reduction of linear expansion coefficient of the solidified product of the melting characteristics of the composition, so as to achieve excellent curing characteristics, efficient manufacturing, Excellent operability
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[0289] The hot-melt curable silicone composition of the present invention and its production method will be described in detail using examples and comparative examples. In addition, in the formula, Me and Vi represent a methyl group and a vinyl group, respectively. In addition, about the curable silicone composition of each Example and a comparative example, the softening point was measured by the following method. In addition, the curable silicone composition was heated at 150° C. for 2 hours to produce a cured product, and the elastic modulus and tensile elongation were measured by the following methods. The results are shown in Table 1.
[0290] [melt viscosity]
[0291] In terms of the melt viscosity of the curable silicone composition at 150° C., a Koka flow tester CFT-500EX (manufactured by Shimadzu Corporation) was used under a pressure of 100 kgf using a nozzle with a diameter of 0.5 mm. measured.
[0292] [Storage modulus]
[0293] The curable silicone compositio...
reference example 1
[0302] Put into a 1L flask the average unit formula which is a white solid at 25°C
[0303] (Me 3 SiO 1 / 2 ) 0.44 (SiO 4 / 2 ) 0.56 (HO 1 / 2 ) 0.02
[0304] 55% by mass of the indicated polyorganosiloxane resin-xylene solution 270.5 g and 1,3-divinyltetramethyldisiloxane complex of platinum 1,3-divinyltetramethyl 0.375 g of a disiloxane solution (content of platinum metal = about 4000 ppm) was uniformly stirred at room temperature (25° C.) to prepare a disiloxane resin (1) containing 10 ppm by mass of platinum metal. Toluene solution. In addition, this organopolysiloxane resin (1) does not soften or melt even when heated to 200° C., and does not have thermal fusibility. In addition, the weight-average molecular weight measured by GPC in a toluene solvent was 18500 Da.
reference example 2
[0306] Put into a 1L flask the average unit formula which is a white solid at 25°C
[0307] (Me 3 SiO 1 / 2 ) 0.46 (SiO 4 / 2 ) 0.54 (HO 1 / 2 ) 0.02
[0308] 55% by mass of the indicated polyorganosiloxane resin-xylene solution 270.5 g and 1,3-divinyltetramethyldisiloxane complex of platinum 1,3-divinyltetramethyl 0.375 g of a disiloxane solution (content of platinum metal = about 4000 ppm) was uniformly stirred at room temperature (25° C.) to prepare a disiloxane resin (2) containing 10 ppm by mass of platinum metal. Toluene solution. In addition, this polyorganosiloxane resin (2) does not soften or melt even when heated to 200° C., and does not have thermal fusibility. In addition, the weight-average molecular weight measured by GPC in a toluene solvent was 11000 Da.
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