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Method of measuring an alignment mark or an alignment mark assembly, alignment system, and lithographic tool

A technology of aligning marks and alignment systems, which is applied in the photoengraving process, optics, instruments and other directions of the pattern surface, and can solve the problems of sensitivity and so on.

Pending Publication Date: 2021-11-09
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a disadvantage of alignment marks with internal structures is that they may be more sensitive to the location of the scanning path of the spot of the measuring beam above the alignment marks due to the use of internal structures

Method used

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  • Method of measuring an alignment mark or an alignment mark assembly, alignment system, and lithographic tool
  • Method of measuring an alignment mark or an alignment mark assembly, alignment system, and lithographic tool
  • Method of measuring an alignment mark or an alignment mark assembly, alignment system, and lithographic tool

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Embodiment Construction

[0067] In this document, the terms "radiation" and "beam" are used to cover all types of electromagnetic radiation, including ultraviolet radiation (e.g. at wavelengths 365, 248, 193, 157 or 126 nm) and EUV (extreme ultraviolet radiation, e.g. in the range of about 5 to 100 nm).

[0068] The terms "reticle", "mask" or "patterning device" as employed herein may be broadly interpreted to refer to a general patterning device which may be used to impart a patterned cross-section to an incoming radiation beam , corresponding to the pattern to be created in the target portion of the substrate. In this context, the term "light valve" may also be used. Besides classical masks (transmissive or reflective, binary, phase-shifted, hybrid, etc.), other examples of such patterning devices include programmable mirror arrays and programmable LCD arrays.

[0069] figure 1 A lithographic apparatus LA is schematically depicted. The lithographic apparatus LA comprises an illumination system ...

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Abstract

The invention provides a method of measuring an alignment mark or an alignment mark assembly, wherein the alignment mark comprises grid features extending in at least two directions, the method comprising: measuring the alignment mark or alignment mark assembly using an expected location of the alignment mark or alignment mark assembly, determining a first position of the alignment mark or alignment mark assembly in a first direction, determining a second position of the alignment mark or alignment mark assembly in a second direction, wherein the second direction is perpendicular to the first direction, determining a second direction scan offset between the expected location of the alignment mark or alignment mark assembly in the second direction and the determined second position, and correcting the first position on the basis of the second direction scan offset using at least one correction data set to provide a first corrected position.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from EP Application 19165581.0 filed on March 27, 2019, which is hereby incorporated by reference in its entirety. technical field [0003] The invention relates to a method of measuring an alignment mark or an alignment mark assembly, an alignment system for measuring an alignment mark or an alignment mark assembly and a lithography tool comprising such an alignment system. Background technique [0004] A lithographic apparatus is a machine configured to apply a desired pattern to a substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). For example, a lithographic apparatus may project a pattern (often also referred to as a "design layout" or "design") of a patterning device (such as a mask) onto a radiation-sensitive material (resist) provided on a substrate (such as a wafer). ) layer. [0005] As semiconductor manufacturing ...

Claims

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Application Information

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IPC IPC(8): G03F9/00
CPCG03F9/7088G03F9/7076
Inventor F·G·C·比杰南R·布林克霍夫
Owner ASML NETHERLANDS BV
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