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White light LED junction temperature and fluorescent glue temperature measuring device

A technology of temperature measurement and fluorescent glue, which is applied in the direction of measuring devices, thermometers, measuring heat, etc., can solve the problems of large fluctuations in measurement data, low measurement accuracy, and cumbersome operations, and achieve the effects of stable data, high accuracy, and low price

Active Publication Date: 2021-11-19
XIHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to overcome the problems of low measurement accuracy, slow speed, cumbersome operation and large fluctuation of measurement data in the existing white light LED junction temperature and phosphor temperature measurement, and provide a new structure junction temperature device

Method used

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  • White light LED junction temperature and fluorescent glue temperature measuring device
  • White light LED junction temperature and fluorescent glue temperature measuring device
  • White light LED junction temperature and fluorescent glue temperature measuring device

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Embodiment Construction

[0030] Such as figure 1 It is the composition schematic diagram of the present invention-a white light LED junction temperature and fluorescent glue temperature measuring device. The constant current source (1) is a programmable power supply, working in constant current mode, with a power accuracy of 1%; the thermocouple thermometer (2) is UNI-T UT320D, used to measure the temperature of the thermocouple (150) Temperature; thermal resistance thermometer (3) is a WSN-101 digital display meter, connected to two terminals (125), used to measure the temperature of the Pt100 platinum resistance chip (120).

[0031] Such as figure 2 It is a schematic diagram of the first embodiment of the tested sample of the present invention—a white light LED junction temperature and fluorescent glue temperature measuring device. The tested LED chip (110) is the S-75ABFSD flip-chip LED chip of Sanan Company, with a size of 1.8*1.8*0.5mm. The Pt100 platinum resistance chip (120) is a German Sen...

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Abstract

The invention relates to a white light LED junction temperature and fluorescent glue temperature measuring device. The device comprises a temperature measuring meter, a current source and a measured LED chip, and is characterized by comprising a Pt100 platinum resistor chip provided with two circles of mutually insulated electrodes, a micro thermocouple and a bottom plate, wherein a measuring point of the micro thermocouple is solidified in the fluorescent glue, and the measuring point is not in contact with the LED chip; and the bottom plate is provided with two electrodes which are insulated from each other, and the electrodes of the bottom plate are respectively welded with the electrodes of the platinum resistor chip and are electrically insulated. The device for measuring the junction temperature and the fluorescent glue temperature of the white-light LED disclosed by the invention can be used for directly measuring, and precision is higher than that of the existing scheme.

Description

technical field [0001] The invention relates to the field of temperature measurement of LED junction temperature and fluorescent glue, in particular to the field of direct rather than indirect measurement of LED junction temperature and fluorescent glue temperature. Background technique [0002] The LED junction temperature is directly related to the life of the LED. In recent years, research has found that the fluorescent glue has a phenomenon of heating, which will greatly increase the junction temperature, so the measurement of the LED junction temperature and the temperature of the fluorescent glue are very important. [0003] The most common method of LED junction temperature measurement is the direct measurement method of pins. The existing problem is that the pins are connected to the pins through the PN junction through thin metal wires (10um level), and the metal wires have a large thermal resistance. Board welding, the heat capacity of the printed board also produc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/18G01K7/02
CPCG01K7/18G01K7/02
Inventor 靳斌王鹏
Owner XIHUA UNIV