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Thick film hybrid integrated circuit product baking parameter determination method

A hybrid technology of integrated circuit and thick film, which is applied in the field of determining the baking parameters of thick film hybrid integrated circuit products, can solve the problems of no basis for the accuracy of process parameters, and the inability to carry out process and optimization in a targeted manner, and achieve shortened verification cycle effect

Active Publication Date: 2021-11-19
SHENZHEN ZHENHUA MICROELECTRONICS
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for determining the baking parameters of thick-film hybrid integrated circuit products, so as to solve the problem that the accuracy of the process parameters of the adhesive glue used in the existing thick-film hybrid integrated circuit products has no basis and cannot be targeted. Technical Issues in Carrying out Process Optimization

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  • Thick film hybrid integrated circuit product baking parameter determination method
  • Thick film hybrid integrated circuit product baking parameter determination method
  • Thick film hybrid integrated circuit product baking parameter determination method

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Embodiment Construction

[0031] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .

[0032] see Figure 1 to Figure 3 , the invention discloses a method for determining the baking parameters of thick-film hybrid integrated circuit products. The baking process of thick-film hybrid integrated circuit products is carried out in thermogravimetric-infrared-gas chromatography equipment, and thermogravimetric-infrared-gas mass spectrometry The combined equipment includes a thermogravimetric analyzer, an infrared spectrometer, and a gas spectrometer, which integrates the three instruments. The method for determining the baking parameters of the thick-film hybrid integrated circuit product includes the following steps:

[0033] S101. Sampling ...

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Abstract

The invention discloses a thick film hybrid integrated circuit product baking parameter determination method, which comprises a sampling step, a sample weighing step, a water vapor quantitative measurement step and a water vapor qualitative measurement step, and is characterized by comprising the following steps: taking an adhesive glue sample from a thick film hybrid integrated circuit product; placing the sample in a thermal weight loss analyzer, weighing the weight of an initial sample, heating the sample by using the thermal weight loss analyzer to volatilize water vapor from the sample, weighing the weight of a final sample when the weight of the sample does not change any more, and importing the weight of the sample in each time period and heating temperature data into a display screen; performing infrared spectrum detection on water vapor volatilized from the sample by using an infrared spectrometer, performing quantitative analysis on the water vapor, and importing concentration data of each component of the water vapor into a display screen; using a gas chromatograph-mass spectrometer for carrying out qualitative detection on the water vapor, respectively obtaining each component in the water vapor and a relative concentration value corresponding to each component by utilizing a curvilinear equation, and importing each component and relative concentration data thereof into a display screen.

Description

technical field [0001] The invention relates to the technical field of gas detection, in particular to a method for determining baking parameters of thick-film hybrid integrated circuit products. Background technique [0002] The manufacturing process steps of thick film hybrid integrated circuit products include gluing steps, mounting steps and curing steps. The gluing steps and mounting steps are all carried out in the placement machine, that is, the adhesive glue is first applied on the ceramic substrate. , several devices are bonded on the ceramic substrate that has been glued, and the curing step is carried out in a curing furnace. . [0003] However, in the existing production of thick film hybrid integrated circuit products, the state of the adhesive is judged by the naked eye, and then the performance test of the entire product is carried out, and the baking temperature and time are adjusted at any time according to the needs, resulting in the use of There is no ba...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N5/04G01N21/3554G01N30/02
CPCG01N5/045G01N21/3554G01N30/02
Inventor 王晓卫祝涵陈如平
Owner SHENZHEN ZHENHUA MICROELECTRONICS
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