Horizontal electroplating feeding device and feeding method forPCB

Abstract

The invention discloses a horizontal electroplating feeding device for a PCB (Printed Circuit Board). The horizontal electroplating feeding device is characterized by comprising a rack, a PCB conveying device arranged on the rack, a board beating device arranged at the feeding end of the PCB conveying device, a board chasing positioning device arranged on the rack, a feeding sensor and a control device, when the feeding sensor detects that the PCB is fed in place, the control device controls a board beating motor of the board beating device to work, a board beating baffle is driven to act to enable the PCB to be close to the side, and an adsorption device is controlled to act to position the PCB. The control device controls a lifting device to act and adjusts the running speed of a sliding table according to a signal, detected by the distance detection sensor, of the distance between the feeding plate and the chasing plate, so that the distance between the feeding plate and the chasing plate is consistent with the distance between the PCB and another PCB. The horizontal electroplating feeding device for the PCB provided by the invention is high in plate edge positioning and plate chasing positioning precision, time-saving and labor-saving, and the labor cost is reduced. The invention further provides a horizontal electroplating feeding method for the PCB.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a PCB board horizontal electroplating feeding device and a feeding method. Background technique [0002] PCB (Printed Circuit Board, printed circuit board), is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. During the production process of PCB boards, it is necessary to align them so that their positions are suitable for subsequent production and processing; at the same time, it is also necessary to track and position adjacent circuit boards so that the distance between adjacent circuit boards is always and at the same position. The same horizontal line facilitates the subsequent process. [0003] The current horizontal electroplating feeding process of circuit boards is: manual board placement -> manual side positioning -> manual board positioning limit, th...

AI Technical Summary

Problems solved by technology

[0003] The current horizontal electroplating feeding process of circuit boards is: manual board placement -> manual side positioning -> manual board positioning limit, this process has the following disadvantages: two manual stations are occupied, and labor costs are high; Long-lasting work; positioning by the side and manual board tracking have low positioning and limit accuracy, which affects the processing accuracy of subsequent circuit boards

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